On December 28, 2021, the trial production of the newly-built production base of HKAA Semiconductor Materials Technology Corporation was successful. The automatic production line of the punching machine was officially launched, and the first batch of punching lead frames was successfully produced.
The success of the trial production is an important milestone in the development of HKAA, which marks the official entry of HKAA into the production stage.
The HKAA advanced packaging materials project has a total investment of US$300 million and is engaged in the R&D and production of stamped and etched lead frame materials.
The extensive product portfolio covers stamped & etched lead frames; with Ag or Ni/Pd/Au plating, or bare copper; IC package or LED pre-molded, etc..
The lead frame products are widely used in different end applications, covering computing, communications, consumers, industrial, and even automotive.
The patented proprietary surface roughening technologies, namely Brown Oxide Treatment (BOT) and Micro-etching 2 (ME-2), enable MSL1 package reliability standard and well accepted in the market. For cost-competitive solution, we are the first supplier to offer 100x300mm large-strip high-density lead frame.