-The new 3M hollow glass beads are a small particle size and lightweight high-frequency and high-speed communication additive for 5G substrates and composite materials
-Compared with other existing material additives, the new 3M hollow glass microsphere products have a very low dielectric constant, which is beneficial to reduce power loss during signal transmission and reduce communication interference
-The new 3M hollow glass bead product can reduce the material cost of the substrate
Recently, 3M launched a new product of insulating glass beads suitable for the 5G field. As the latest member of the 3M high-strength insulating glass beads product series, the new product is a high-frequency and high-speed (HSHF) resin additive with excellent performance and low signal loss. , Can be used in the composite materials of 5G equipment and components. In the context of the continuous popularity of 5G, 3M hollow glass microbeads can help R&D personnel design communication products that meet the demanding information transmission requirements and higher power, while reducing the unit volume of raw materials cost
3M hollow glass beads suitable for the 5G communication industry can help designers of high-frequency and high-speed (HSHF) copper clad laminates (CCL) to create smooth and lightweight 5G substrates, and then produce printed circuit boards (PCBs) for 5G wireless communication. ) The new 3M glass beads can also be applied to plastic composite materials for 5G communication products, such as base station components, radomes, and even mobile phone housings
Signal loss and interference are always important challenges in the production of printed circuit boards (PCBs). The signal frequency of 5G networks is higher, making this problem more and more prominent. Using 3M hollow glass beads as resin additives helps engineers accurately master copper clad foil The dielectric properties of the laminate (CCL) reduce the transmission loss at high signal frequencies and improve the reliability of communication. Among the existing material additives, 3M hollow glass beads are one of the additives with the lowest dielectric constant. The industry is attractive
"It has been more than half a century since the birth of 3M hollow glass bead products. Recent innovations have allowed us to design new glass beads for the unique needs of 5G electronic products. The new 3M hollow glass bead products are tailor-made for the 5G communications industry. Customization can effectively increase the data transmission speed of high-frequency signals." Brian Meyer, President of 3M Advanced Materials Products Department, said, "3M is committed to promoting the development of the 5G field. We are very happy to apply our technology to the most important fields and maximize the value. Work with all parties to develop materials with low signal loss, and continue to help R&D personnel cope with the current and future challenges in the field of high-speed wireless communications"
In addition, adding 3M hollow glass beads to the 5G high-frequency and high-speed copper clad laminates, replacing the usual high-cost resin materials, can help reduce the material cost of the substrate. Not only that, compared with traditional solid mineral fillers, the lightweight 3M glass beads Can occupy up to about 20 times the space. In terms of the cost per unit volume (not the price per pound or per kilogram), the ability of 3M hollow glass beads to reduce costs and increase efficiency in many applications cannot be underestimated
"Relying on 3M's global manufacturing, R&D, and service system, 3M insulating glass microbead products have been adopted by 5G copper clad laminate and printed circuit board production customers in various global markets including China" 3M Global Glass Bead Experiment Room Manager Andrew D'Souza said, “Currently, 3M hollow glass microsphere products are only suitable for signal frequency bands below 6GHz, and a new generation of 3M hollow glass microbead solutions for higher signal frequency bands are currently under development.”