The 5G mobile phone heat dissipation market is expected to achieve high growth, and new heat dissipation materials and solutions such as soaking plates and graphene will usher in new development opportunities.
We believe that the market has underestimated the heat dissipation requirements of 5G mobile phones. 5G mobile phones 1) The performance of processors has been greatly improved, and some processors use a plug-in 5G baseband design, which greatly increases power consumption; 2) The screen uses high resolution, high refresh rate, and consumes Electricity increases; 3) More antennas are built in, and the signal will be searched frequently when the 5G signal is weak, which has higher power consumption and heat generation. Therefore, unlike the market perception, the requirements for heat dissipation of 5G mobile phones are not just ordinary upgrades, but need to be comprehensively improved through new heat dissipation materials and three-dimensional heat dissipation design. We believe that it is difficult for a single heat dissipation material to meet the heat dissipation requirements of 5G mobile phones. The heat dissipation plate + graphite/graphene combination will become the mainstream choice for 5G mobile phones. Among them, the market size of 5G mobile phone heat dissipation plates and graphene heat dissipation is expected to achieve rapid increase.
In the field of base stations, traditional heat dissipation schemes are difficult to meet the heat dissipation requirements of 5G base stations. The heat dissipation scheme of semi-solid die-casting + blown plate, which combines heat dissipation performance and product weight reduction, is expected to exceed market expectations.
The power consumption of the 5G base station is about 3kW~4kW, which is about 2~3 times higher than that of the 4G base station; and the size and weight of the 5G base station antenna and other units have also increased significantly, so it is urgent to realize the improvement of the base station cooling module cooling performance + products Weight reduction. According to Yizumi's official website, the thermal conductivity of semi-solid die-castings is 50% higher than that of general die-castings, which can meet the requirements for rapid heat dissipation of base station products; at the same time, its light weight feature can help base station products reduce weight by 30%. In addition, the inflation board has the advantages of fast thermal conductivity, high reliability, and high cost performance. It can also improve the heat dissipation performance and reduce the weight of the device. Therefore, we believe that semi-solid die-casting + inflation plate is expected to become the mainstream solution for 5G base station heat dissipation.
The market has more qualitative discussions on 5G terminal heat dissipation solutions. We further quantitatively measured the market scale development of each heat dissipation solution.
We believe that the three-dimensional heat dissipation design of the soaking plate + graphite/graphene is the first choice for 5G mobile phones. Among them, the soaking plate is the main heat dissipation of 5G mobile phones. Compared with the heat pipe, it has been upgraded from "line" to "plane". Heat is transferred to all directions, effectively enhancing the heat dissipation efficiency. We believe that under the dual drive of rapid increase in penetration rate of 5G mobile phones + rapid increase in heat dissipation rate of heat spreading plate, the global market size of 5G mobile phone heat spreading plate cooling is expected to grow rapidly from 175 million yuan in 2019 to 20-22 years. 1.289 billion yuan, 2.803 billion yuan, 4.332 billion yuan.
Graphite and graphene play a role in assisting heat dissipation in the 5G mobile phone cooling system.
Graphite heat dissipation film began to be applied to smartphones in 2010, and has now entered a stage of steady development; we estimate that the global smartphone graphite heat dissipation film market size was 5.76 billion yuan in 19 years, considering the 20-year new crown epidemic on smartphone shipments In view of the negative impact, we predict that the global smartphone graphite heat dissipation film market size will be 49.03, 5.574, and 6.071 billion yuan in 20-22, respectively, and it is expected to resume stable growth in 21-22. Graphene thermal conductive film will be applied to smart phones in 2019, and it is still in the stage of rapid development. We estimate that the global market scale of 5G mobile phone graphene thermal conductive film in 2018 was 0.08 billion yuan. Against the background of rapid penetration of 5G mobile phones, it is predicted that 20 In -22 years, the market scale will rapidly increase to 0.64, 1.23, and 173 million yuan.
Regarding the competitive landscape of the heat dissipation industry, in the field of graphite heat dissipation, Panasonic, Kaneka, and Graftech of the United States are the forerunners of the industry, and CZTY Carbon Technology Co., Ltd. and BJZS Thermal Management Technology are the main manufacturers of graphite heat dissipation films in China. CZTY has customers such as Samsung, Huawei, OPPO, VIVO, etc.; BJZS Technology cut into the Apple supply chain in 2014 to become Apple's supplier of synthetic graphite heat dissipation materials; while consolidating the leading position of graphite heat dissipation, CZTY and BJZS are also stepping up heat pipes/soaking plates The layout provides customers with a full range of heat dissipation solutions. In the field of graphene heat dissipation, CZFX graphene technology and MR graphene technology have emerged, providing graphene thermal films for Huawei and Xiaomi. In the field of heat pipes/Vapor Chamber, currently Taiwanese manufacturers such as Chaozhong, Shuanghong, Qikun, and Taishuo are in a leading position, and manufacturers such as SBD, JY Technology, LY, and SZFY have been deployed one after another.