According to a report from Tom's Hardware, Acer has introduced a new CPU thermal material on IFA, which officially claims that processor performance can be improved by 12%.
Acer said that the new thermal interface material (TIM) has improved 77.7% thermal conductivity and can achieve 12.5% CPU performance improvement.
When foreign media spoke with Acer representatives, they learned that Acer claims that the effect of this heat dissipation material is better than liquid gold, but further experiments are needed to prove it.
Acer said that the new thermal material increases thermal conductivity, which is expected to reduce the size of the notebook's internal heat sink, resulting in higher performance and a thinner and lighter body design. Acer plans to use this thermal material in new versions of its Helios 700 series laptops and Orion 9000 desktops.