Recently, SZOF Electronic Materials Technology Group Co., Ltd. announced that it has successfully developed a 0.3mm ultra-thin VC: Vapor Chamber. This technology will provide a new possibility for further improving the heat dissipation performance of electronic products.
With lighter, thinner and better heat dissipation performance, VVC: Vapor Chamber heat dissipation has become the standard configuration of 2020 flagship mobile phones such as Huawei, Xiaomi, and OPPO. However, due to the higher cost of VC: Vapor Chamber compared to the second-generation heat dissipation technology, it is currently only widely used in flagship high-end models.
The VC:Vapor Chamber developed by SZOF breaks through the traditional structure of laying copper mesh or copper powder sintered capillary core. It is the first in China to adopt a precision etching microstructure integrated capillary core process. Its thickness is only 0.3mm, and the overall thickness is reduced by approximately 50um not only simplifies the process, but also reduces the cost, the key is to achieve a stable process level that can be mass-produced, which makes it possible for VC:Vapor Chamber to be applied to low-end mobile phones.
This time SZOF adopts the etched capillary core and continuous support column structure design, which supports the flexible design that the product can be bent at 180°, which facilitates the thermal management design of different customers; at the same time, due to the special structural design and advanced technology, SZOF adopts The liquid absorption capacity of the etched capillary wick can reach a liquid absorption height of 13.5cm, a liquid absorption speed of 8mm/s, and can support a heat dissipation power of 5W, which can fully meet the heat dissipation requirements of daily electronic products such as mobile phones.
SZOF continuously upgrades and develops new technologies, and continuously pursues innovation and technological breakthroughs in the field of VC: Vapor Chamber. Following the successful development of 0.3mm ultra-thin VC VC: Vapor Chamber and mass production, SZOF`s 0.27mm VC: Vapor Chamber has also been successfully developed , And passed the laboratory condition test. In the future, SZOF will continue to develop higher performance 0.24mm ultra-thin VC: Vapor Chamber technology, continue to provide customers with the ultimate product experience, and actively assist in improving the heat dissipation performance of electronic products.