Apple's Camera Modules and precision optical lens supplier, SZOF Optoelectronics Technology Group issued an announcement that the company has successfully developed high-end lead frames for semiconductor packaging. It plans to start proofing and trial production with a flip-chip electroless plating production line in the first quarter of 2021. Mass production in the second quarter.
The lead frame is the most important packaging carrier for the chip, and it is also a channel for communication between chip information and the outside world. However, the high-end etching lead frame market has been dominated by Japan and South Korea for a long time, and Chinese companies have been in a catching-up position all year round.
In 2020, OFILM has established a lead frame project with the goal of localization substitution, and successfully developed a high-end etching lead frame with large width, high density, ultra-thin and high reliability.
Based on the existing production line and production technology, SZOF plans to start sampling and trial production with a flip-chip electroless plating production line in the first quarter of 2021. At the same time, it will continue to strengthen R&D investment and build a new production line. It is expected in the second quarter of 2021. The various processes that have been developed are successively introduced into mass production with a brand-new production line.
About SZOF
SZOF is the world`s largest manufacturer of the camera modules, fingerprint sensors and touchscreen components built into smartphones sold globally.
Optoelectronics products for Smartphones,wearable devices, Internet of Things (IOT) sensors and solutions as well as automobiles, both gas powered and electric.
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