Recently, Axus Technolog, a global supplier of chemical mechanical polishing (CMP), wafer thinning and wafer polishing surface treatment solutions for semiconductor applications in the United States, announced a new cooperation with Compound Photonics (CP, also known as CP Display) to accelerate the promotion The pace of 5μm Micro LED moving towards the mass market.
Axus and CP are collaborating to integrate key wafer-level processes to mass-produce CP's 2μm, 1080P Micro LED displays for the next generation of AR glasses. It is worth noting that Axus will deploy the Capstone CMP system with integrated chemical mechanical polishing (Post CMP Cleaning) function to provide wafer planarization and surface treatment solutions, thereby successfully realizing Micro LED wafers and high performance Wafer-level bonding of CMOS backplanes.
Axus' CMP processing capability is essential to realize CP's proprietary small-pitch Micro LED (epitaxial substrate not disclosed) integrated process solution. The Capstone CMP system provides multi-wafer repeatability and in-wafer planar performance, and reliably achieves millions of micron-level electrical contacts between Micro LED and CMOS backplane wafers, and solves key mass production process requirements, namely Always produce Micro LED modules with visual consistency. These Micro LED modules can meet the needs of near-eye display applications such as small, low-power, high-brightness AR/MR.
According to reports, Axus and CP have reached a cooperation in early 2020 to jointly develop the wafer-level bonding process integration between the Micro LED array and the CMOS backplane chip. This deepening of the partnership further demonstrates the determination of both parties to promote the manufacturing process and integration technology of Micro LED displays.
It is also worth mentioning that in addition to CP, Plessey has also chosen a strong alliance with Axus on the road to develop monolithic Micro LED display technology for wearable devices. The three companies have a close cooperation relationship.
At the beginning of February this year, Plessey announced a cooperation with Axus. The area of cooperation between the two parties is high-performance silicon-based gallium nitride monolithic Micro LED. The former purchases metal and oxide CMP and related tools from the latter to achieve Micro LED wafers and high performance. Wafer-level bonding of CMOS backplanes.
In the same month, Plessey and CP also reached a strategic partnership and announced the production of the first batch of fully addressable Micro LED display modules for AR/MR, lighting up the first 0.26 inch diagonal monochromatic natural green integrated Micro LED display module.
So far, the dynamics of major global manufacturers such as CP, Plessey, JBD, Vuzix, Facebook, etc. have shown that Micro LED is continuing to become the display solution with the most potential to meet the key requirements of AR/MR applications. Therefore, the innovation of Micro LED process technology plays a key role in reducing costs and mass production of commercial AR/MR head-mounted devices.