Packaging is one of the key links in the chip field. It requires a series of advanced electronic welding technologies to precisely weld related materials on the corresponding pins of the chip. This link not only plays the role of installing, fixing and protecting the chip, but also a bridge connecting the internal logic circuit of the chip and the external circuit.
In the chip packaging process, the basic welding materials play a major role, which directly determines the mechanical strength and electrical properties of the chip welding, and plays a decisive role in its reliability.
LYHP Semiconductor Material Technology Co., Ltd. focuses on the development and production of "key basic materials for chip packaging".
The company mainly develops and produces electronic and semiconductor materials, and is committed to rapidly promoting the localization of key basic materials for chips and providing overall solutions in the field of chip packaging and welding. Relying on the advantages of multiple technologies and supporting R&D services, its core products have passed the certifications of many large enterprises such as China Electronics Technology Group, Huawei, Beijing Compxiwei, Sichuan Tianyi Kanghe Communication, etc.
"In recent years, we have mainly developed BGA (Ball Grid Array) chip packaging microspheres and high-end CCGA (Ceramic Column Grid Array) solder pillars in the chip field." said Li Tao, director of the LYHP Technology Department.
Among them, the microspheres used for BGA chip packaging are used for chip circuit connection and are called the "foot" of the chip, and their quality directly affects the quality of the chip packaging. Through technological and technological breakthroughs, LYHP successfully developed and mass-produced the microspheres for chip packaging, completed technological breakthroughs in a full set of equipment and technological processes, greatly improved production efficiency, and realized localization from equipment manufacturing to product manufacturing, and The product has reached the strict standard that the defective product rate does not exceed one in two million. Among them, the smallest diameter of the tin alloy balls produced by the company can be as small as 50 microns; it can be customized for any size from 0.05 mm to 1.2 mm and any application temperature from 118 degrees Celsius to 350 degrees Celsius. The technical level is in the leading position in the industry.
CCGA chips packaged with CCGA solder pillars have been widely used in the aerospace field because of their good shock resistance, fatigue resistance and heat dissipation performance, as well as high temperature resistance, high pressure resistance and good moisture resistance. To install the chip on the circuit board, it is usually necessary to complete more than 1,000 soldering posts on a device the size of a dollar coin. In addition, the chip working environment is harsh, which puts forward strict requirements on the consistency and accuracy of related products.
Regarding the production of CCGA welding columns, LYHP has broken the long-term monopoly of the National Aeronautics and Space Administration in this field through breakthroughs in process and technology, and LYHP has become the world's second manufacturer with CCGA welding column mass production capacity.
LYHP has built 4,500 square meters of dust-free workshops, with 5 independently developed solder ball production lines and 16 large-scale testing instruments. The project has been researched and developed since 2005. After years of precipitation, it has completed technological breakthroughs in a complete set of equipment and process flow, and has achieved complete localization from equipment manufacturing to product manufacturing, with completely independent intellectual property rights.