On January 15, HZLA Microelectronics Technology Group issued an announcement that the company is actively advancing the construction of 12-inch silicon wafer projects. The newly-built capacity has been commercialized and has reached an annual production capacity of 1.8 million wafers.
The 12-inch silicon wafers produced by HZLA can be used in the production of power chips, logic chips and memory chips, and the corresponding capacity allocation will be deployed according to subsequent market conditions. The company's 12-inch silicon wafers can reach the 14nm technology node level.
In November 2020, HZLA stated that the company's 12-inch silicon wafer project has passed product verification by several customers and achieved mass production and sales.
HZLA silicon wafers have a market share of about 30% in China and have complete processes and production capabilities for silicon monocrystalline ingots, silicon abrasive wafers, silicon polished wafers, and silicon epitaxial wafers.