The requirements for applications become more demanding, in particular with regard to the consolidation of more power in less space. YNGY addresses these challenges with our gold bonding wire with a diameter up to a size of 15 ~20 microns/μm for very fine applications.
Finer structures and harsher conditions drive the development of the well-established gold bonding wires. For modern applications you need a wide variety of possibilities, depending on the exact requirements of your application. YNGY offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of G1, G2, G3 gold bonding wire, gold clad silver alloy wire, silver alloy wire types. All wires can be adapted exactly to your needs.
