BJBD Non-Ferrous Metal Materials Technology Group focuses on R&D and production of alloy materials in the semiconductor field.
The main products are integrated circuit (IC), semiconductor lighting (LED), camera module and semiconductor discrete device (TR) packaging gold bonding wire, silver bonding wire, copper bonding wire and various alloy wire series products; Production of wire and segment materials for the evaporation of gold, arsenic, and silver for chip back gold deposition.
It has a complete bond alloy wire, copper wire, silver wire production line, production equipment and testing instruments reach the international advanced level, and can provide more than 1 billion meters of bonding wire each year.
The product portfolio includes bonding alloy wire, gold alloy wire, bonding copper wire, palladium-plated copper wire, gold-palladium copper wire, gold-copper wire, bonding silver wire, gold-plated silver wire, silver alloy wire, gold-plated alloy wire, gold-plated palladium alloy A multi-variety bonding wire product family composed of precious metal materials such as silk. The company has a rich product range and complete models. Differentiated products can match different types of packaging needs to meet customer personalized customization needs.
BJDB masters the core technology of the bonding wire production process, and has successively undertaken the subject of the national science and technology major project "Very large-scale integrated circuit manufacturing equipment and complete sets of processes" "Development and industrialization of bonding wires for advanced packaging", and "Communications The subject of "Multimedia Chip Packaging and Testing Equipment and Material Application Engineering", "Bonding Copper Wire for High-end Packaging", passed the subject acceptance successfully.
The company's bonding wire production and sales have been ranked first among local Chinese companies for a long time, and it has been named "China's Top Ten Semiconductor Materials Companies" for three consecutive years