Recently, the monocrystalline silicon wafer production workshop of HZZX Semiconductor Technology Group successfully rolled off the first 12-inch silicon epitaxial wafer. It indicates that HZZX has independent R&D and production capabilities from 12-inch monocrystalline silicon wafers, polishing to epitaxy.
HZZX has successively realized the production of 8-inch and 12-inch monocrystalline silicon polished wafers. The semiconductor silicon polished wafer is the basic material for chip manufacturing, and the epitaxial wafer is a new silicon single crystal layer grown on the polished wafer.
With the continuous development of new energy vehicles, 5G communications, Internet of Things, smart phones and other industries, Chinese chip manufacturers have seen a blowout for semiconductor silicon epitaxial wafers, but there are only a handful of Chinese manufacturers that can produce high-quality semiconductor silicon epitaxial wafers.
The production process of silicon epitaxial wafers is longer and the technical difficulty is also greater. Since the beginning of 2020, HZZX has started the trial production of 12-inch silicon epitaxial wafers. During this period, it has overcome difficulties such as the difficulty of returning foreign technicians and customs clearance of imported equipment, Finally, the first 12-inch silicon epitaxial wafer was rolled off the line at the end of the year, and commercial production was successfully realized.