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China’s first “12-inch automotive-grade power semiconductor wafer manufacturing project” starts construction Hay:I01SHDT

On January 4th, the 12-inch automotive-grade semiconductor wafer manufacturing center project invested by SHDT Semiconductor Technology Group officially started.

The project has a total investment of 12 billion yuan and an estimated annual output of 400,000 wafers. The packaged and tested power device products can be widely used in automotive electronics, computing and communication equipment and other fields.

In July 2020, another wafer technology company in China, SHXS Semiconductor Technology Group, added 300,000 pieces of integrated circuit 300mm high-end silicon wafer R&D and advanced manufacturing projects, with a total investment of 4.6 billion yuan, to build a 300,000 wafer/month capacity The production line of 300mm high-end silicon wafer R&D and advanced manufacturing will greatly enhance China's international competitiveness in the field of large-size silicon wafers and break the long-term monopoly of 300mm silicon wafer production by foreign countries.

With the rapid globalization of electric vehicles, automotive semiconductors are entering a rapid development track. It is estimated that by 2022, the automotive semiconductor market is expected to reach 65.1 billion U.S. dollars, accounting for 12% of the global semiconductor market, and becoming the fastest growing semiconductor segment in the world. Fast market. It is estimated that by 2026, the market share of electric vehicles is expected to exceed that of traditional vehicles, and China will become the world's largest producer and consumer of electric vehicles.

SHDT CEO Zhang Xuezheng said that the huge demand for automotive semiconductors, especially the Chinese automotive market, drove our investment, and we decided to build a 12-inch automotive-grade power semiconductor wafer manufacturing center.

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