On December 28, the China Nonferrous Metals Industry Association and the China Nonferrous Metals Society jointly issued the "Notice on Issuing the 2020 China Nonferrous Metals Industry Science and Technology Award", an 8-inch silicon substrate polishing wafer developed by BJYY Semiconductor Material Technology Group for The IGBT project won the second prize of the 2020 China Non-ferrous Metal Industry Science and Technology Award.
The implementation of the 8-inch silicon substrate polishing wafer project for IGBT has broken through key technologies such as complete 8-inch silicon single crystal growth and 8-inch silicon wafer precision processing, and solved the technical problems of crystal micro-defect control and precise control of silicon wafer geometric parameters. Developed high-quality 8-inch light-doped silicon wafers with few crystal defects and highly precise geometric parameters, which broke foreign technical barriers, fully realized import substitution, and formed a series of core technologies with independent intellectual property rights. The overall technology of the project has reached the international advanced level, and some of the indicators have reached the international leading level.
It is reported that the project successfully implemented the transformation of results, achieved objective economic benefits, and filled the technical gap of 8-inch silicon substrate polishing wafer products for IGBT in China. The mass-produced products entered the market and achieved cumulative sales of more than 300,000 wafers. Nearly 100 million yuan, the prospect is good; at the same time, the radiation of the project results has driven the development of related supporting industries, and has improved the product quality and technology of the existing 8-inch silicon materials of the project unit. The products have shown good international competitiveness and promoted China The improvement of the high-end semiconductor industry chain has enabled China's semiconductor equipment components and high-end silicon materials for equipment components to gradually get rid of dependence on foreign countries, enhance the country’s competitiveness and strategic position, and ensure the sustainable and healthy development of China’s integrated circuit industry.