On April 12, the advanced packaging materials project with an investment of US$300 million by HKAS Semiconductor Materials Technology Group officially started construction.
HKAS advanced packaging materials project is engaged in the research and development and production of stamped and etched lead frame materials. The project is expected to be put into production in the first half of 2022.
HKAS is the world’s largest manufacturer of integrated and packaging equipment for the semiconductor and LED industries (semiconductor packaging equipment has the largest market share in the world, packaging materials has the second largest market share in the world, and the largest in China) and a joint investment by Chinese semiconductor companies. It mainly provides key supporting facilities for well-known companies in the field of integrated circuit packaging and testing such as Changjiang Electronics, Huatian, and Tongfu.
After the project is completed and put into production, it will become the largest semiconductor packaging material production base of the group in China.