On November 23, 2022, HBDL Microelectronic Materials Technology Corporation, China's leading manufacturer of CMP polishing pads, announced that:
At present, the company has an annual production scale of 300000 high-end CMP polishing pads.
The company's new project with an annual output of 200000 pieces of polishing pads and 300000 pieces of core supporting raw materials has been completed.
The polishing pad produced by the new production line is in the trial production stage, and has been sent to mainstream customers for testing. At present, the customer feedback test data is good.
The core raw materials of CMP polishing liquid are mainly abrasive particles. At present, China mainly imports Japanese and American raw materials.
Before that, the grinding particles have not been produced domestically, because the technical difficulty of this piece is still very high.
HBDL started from the development of grinding particles of core raw materials upstream of the polishing solution. At present, it has realized the independent preparation of three types of grinding particles, namely, ultrapure silica sol, sodium silicate sol and aluminum oxide. The development of cerium oxide grinding particles is also progressing as planned.
In terms of capacity construction, the company currently has a 5000 ton annual CMP polishing liquid production line, and the new 20000 ton annual CMP polishing liquid expansion project and grinding particle supporting expansion project are stepping up capacity construction.
In 2018, the company acquired China's leading precision mold manufacturer: ZJWB Precision Mold Technology Corporation
ZJWB focuses on R&D and manufacturing of ultra precision injection mold, and HBDL cooperates with ZJWB to develop wafer ultra precision carrier.
The shortage of wafer carriers stems from two aspects:
I. It is a demand for expansion of production. Compared with the wafer, the single product price of the wafer carrier is not high, but it has a significant impact on the yield of the wafer mass production.
Once the vehicle supplier enters the wafer factory, it will be very sticky with customers and difficult to replace. The difficulty of the vehicle lies in the high precision requirement, which requires high mold design and injection molding process.
II. It is the difficulty of the production cycle and verification cycle. The maximum mold developed by ZJWB currently weighs 15 tons, and the precision requirement is extremely high. In the process of customer verification, we need to communicate with customers repeatedly from T0, and the speed is also critical.
ZJWB has core technology and will start the design, development and manufacturing of new products from the most difficult 12 inch ultra precision wafer carrier.