On May 25, 2022, China's leading HDI PCB and IC substrate manufacturer: SZBM Electronic Material Technology Corporation issued an announcement:
The company will build a new IC packaging carrier production base with a total investment of about 6 billion yuan and an area of about 200 Mu. The new production facility is mainly engaged in the production of high-end high-density packaging carrier products.
Product application areas include memory chips, MEMS chips, high-speed communication markets and Mini LEDs, etc.