JSTG Thermal Management Material Technology Corporation is committed to R&D and the production of high-performance heat dissipation materials and components for power semiconductor IGBT packaging and integrated circuits and other fields, providing customers with overall solutions for heat dissipation materials.
The company has developed a variety of SiCp/Al, diamond, aluminum diamond, copper diamond, molybdenum sheet, molybdenum copper, tungsten copper, copper molybdenum copper, copper-molybdenum copper-copper, Kovar alloy, Invar alloy and other products, which are applied in microwave devices,High-power devices and microelectronic devices.
Heat Sink(Baseplate)
Double-sided heat dissipation material (Spacer)
Microwave Package Shell
Diamond,Copper diamond,Aluminum diamond
Alloy Heat Dissipation Material
Copper-Molybdenum Copper-Copper
Copper Molybdenum Copper
Tungsten Copper
Molybdenum copper
Molybdenum sheet
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