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China’s leading manufacturer of etching metal Lead Frame,contact, contactless, dual interface, gold-plated, palladium-plated IC card packaging frames Hay:I04SDXH

SDXH Electronic Technology Group is an integrated circuit enterprise, focusing on lead frame, module packaging, wafer thinning, dicing and testing innovative technologies. It is one of the 26 members of the national financial card chip localization union, presided the national standards of integrated circuit (card) package framework, obtained dozens of patents and software copyrights, our products, and production technology are fully self-developed, substituted imports and realized exported to the global high-end market. We have passed the ISO9001: 2015 quality management system and the ISO14001: 2015 environment management system certification, also obtained the certificates of safety system CC EAL 5+ and CQM, the quality ranks in the forefront of the industry.

It is a high-tech enterprise, which has the industry-leading manufacturing facilities and R & D (Research and Development) center, we established the efficient production capacity, high-level produce technology, and perfect upstream and downstream industry chain supports.

SDXH can produce contact, contactless, dual interface, gold-plated, palladium-plated and other multiple series, dozens of specifications of IC card packaging frames and module products, and we can custom develop and produce personalized smart card products according to customers' requirements . The production capacity ranks second in the world. We are the important partner of the domestic well-known and internationally well-known security chip design companies, which includes CEC huada Electronic Design, Unigroup Guoxin Microelectronics, Samsung Electronics, Shanghai Fudan Microelectronics, Datang Microelectronics and so on. Our products are sold to the European Union, Southeast Asia, Russia, Africa, South America, and other countries and regions, widely used in the fields of communication, finance, transportation, identification, IoT and public safety.

We have achieved the mass production of the etched metal lead frame and IoT eSIM card packages, and have broken the international monopoly, filled the domestic gap and widely replaced imports. At the same time, we have occupied a certain market share in the IoT security field, opening up a broad path for the subsequent development of enterprises.

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