The global most powerful information hub of high performance & advanced materials, innovative technologies

to market your brand and access to the global demand and supply markets

China’s leading RTF copper foil, HVLP copper foil manufacturer presided over the revised copper foil standard was approved and released Hay:A03TGTB

A few days ago, the State Administration of Market Supervision and Administration of China and the National Standardization Administration jointly issued the National Standards Approval Announcement No. 20 of 2020. The revision of "GB/T 5230-2020 Electrolytic Copper Foil for Printed Boards" led by TGTB Copper Foil Technology Group It was officially announced and will be officially implemented on August 1, 2021. This standard specifies the classification, appearance, size, physical performance requirements, process requirements, special requirements, quality assurance regulations, inspection methods, packaging, marking transportation and storage of electrolytic copper foil for printed boards.


Electrolytic copper foil for printed boards is an important basic electronic material for the manufacture of printed board substrates such as rigid foil clad laminates, flexible foil clad laminates, microwave circuit substrates, resin-coated copper foils, etc. Its quality directly affects The quality and reliability of printed board substrates and printed boards.


Some developed countries in the world have made clear regulations on the classification, quality grade, various technical requirements, quality assurance regulations, test methods, packaging and marking of metal foil for printed boards. However, China’s "GB/T 5230 "1995 Electrolytic Copper Foil" only includes two types of electrolytic copper foil, standard electrolytic copper foil and high ductility electrolytic copper foil. The product variety is small and cannot meet the needs of technology and market development. There is no uniform standard for the inspection of electrolytic copper foil products, an important electronic material widely used in copper clad laminates, and the quality cannot be guaranteed, which has become a bottleneck restricting the development of the industry. Therefore, it is very urgent to study and formulate the standard of "Electrolytic Copper Foil for Printed Boards" and make specific provisions on the technical requirements of electrolytic copper foil for printed boards. The formulation of this standard will surely guide China's copper electrolytic foil for printed boards Scientific research, production, quality inspection, standardize the market, promote the development and quality improvement of China's electrolytic copper foil for printed boards, and play an active role in the development of relevant upstream and downstream emerging industries.


This standard is formulated on the basis of studying advanced foreign standards and combining with the actual conditions of the Chinese industry. The electrical performance, physical performance, special performance and other main performance indicators of various types of electrolytic copper foil in the standard are in line with foreign advanced standards; the standard E-01, E-02, E-03 foil room temperature tensile strength, E03-9 , The high temperature tensile strength of E03-12 and E03-18 foil, the room temperature elongation of E-01 and E-03 foil and the high temperature elongation index of E03-18 and E03-35 foil are all higher than the requirements of relevant foreign standards; The process requirements of high temperature oxidation resistance in the standard, the room temperature tensile strength and elongation index of E02-12 foil, copper powder detection methods, and warpage detection methods fill the gaps in domestic and foreign standards.

Please check the message before sending