Wu Neng, deputy general manager of HZLA Electronic Technology Group, said in an interview with Hay Think that thanks to the continuous improvement of the integrated circuit industry at the end of the second quarter, the company is currently full of orders on hand, production is running at full capacity, and product supply exceeds demand.
In addition, although the gallium arsenide radio frequency chip project invested by HZLA has not yet achieved profitability, the market prospects are good, and it will become one of the main growth points of the company's performance next year.
The HZLA gallium arsenide radio frequency chip project has been under construction since 2016. The annual production capacity of 30,000 chips was completed and put into production in May 2019. After more than two years of technology accumulation and customer verification, it has now entered the stage of heavy business.
Wu Neng said that the gallium arsenide radio frequency chip project is expected to achieve full production in the first quarter of next year. At present, the main customers are domestic customers who do mobile phone chip design and face recognition chip design. At the same time, the company is currently implementing expansion and is expected to have an annual production capacity of 70,000 pieces by the end of June 2021.
Since its establishment in 2002, HZLA has always focused on the R&D and manufacturing of semiconductor materials, semiconductor chips and related products. During the journey from scratch, HZLA insists on increasing investment in technology research and development, and by undertaking major national scientific and technological projects, introducing high-end technology We continuously strengthen our own R&D strength and technology accumulation in various ways such as talents.
At the beginning of its establishment, the company introduced a full set of Schottky chip technology, production equipment and quality management system with international advanced level from ON Semiconductor, and established a 6-inch semiconductor production line, which became the domestic advanced level of power device production line.
Since 2009, the company has become a major global supplier in the silicon-based solar energy dedicated Schottky chip market.
In 2011, the company completed the shareholding system transformation. In 2012, it acquired Japan's Sanyo Semiconductor and Japan's Asahi Kasei MOSFET power device production lines.
On June 15, 2015, HZLA successfully acquired wholly-owned domestic semiconductor wafer manufacturing giant ZJJR Electronic Technology Co., Ltd., and became one of the few in China that has silicon monocrystalline, silicon abrasive wafers, silicon polished wafers, silicon epitaxial wafers and chips. A complete industrial platform for manufacturing capabilities, spanning the two sub-sectors of semiconductor discrete devices and semiconductor silicon materials.
At present, the two large-scale enterprises in the sub-sectors are also China's competitive industrial platforms for semiconductor materials, power semiconductors and integrated circuit manufacturing.
At present, HZLA has a complete industrial chain of silicon monocrystalline ingots, silicon abrasive wafers, silicon polished wafers, silicon epitaxial wafers and chip manufacturing integrated circuit companies.
As a result, three major business divisions including silicon wafers for integrated circuits, discrete semiconductor devices, and gallium arsenide radio frequency chips are formed.