On January 12, China's leading ceramic thin film hybrid integrated circuit manufacturer announced that the company will build a new "Ceramic Thin Film Hybrid Integrated Circuit Manufacturing Base" project.
Ceramic thin-film hybrid integrated circuits refer to the active components, passive components and interconnection leads between them, all using metals, semiconductors, metal oxides, and multiple A kind of metal mixed phase, alloy or insulating dielectric film, and integrated circuit made by vacuum evaporation, sputtering and electroplating process.
Compared with thick film integrated circuits and microwave printed circuits, ceramic thin film hybrid integrated circuits adopt electronic-grade ceramic substrate materials and semiconductor processing technology, so they have high integration density (minimum line width, line distance up to 10 m or less), precision High (up to ±2 m), small size (up to 1mm or less), and has the advantages of low signal loss, good thermal conductivity, good high-frequency characteristics, and stable temperature characteristics. It can be applied to 5G optical modules and military radars , Laser manufacturing, autonomous driving and other fields.