Ma Wenzhen, general manager of Foshan Huazhi New Materials Co., Ltd. (hereinafter referred to as "Huazhi New Materials") will organize a meeting to convene the company's technical staff and engineers of Changdian Technology to open a product for a 5G communication base station. Conference call to discuss thermal solutions for chips.
Huazhi New Material is a provider of heat dissipation and packaging solutions for high-power semiconductor devices. With the first domestically-made precision thermal bonding technology for heterogeneous materials and a unique formula of high thermal conductivity, Huazhi New Material's chip cooling substrate has Excellent thermal conductivity and high reliability, solve the problem of heat dissipation of high-power chips in major projects such as Beidou satellites, phased array radars, 5G communication base stations, etc., and fill domestic technical gaps.
At the same time, the products of Huazhi New Materials are also used to solve the heat dissipation problems of core chips in high-power semiconductor lasers, cloud computing data centers, new energy vehicles, high-speed rail, high-voltage power transmission, and wind power generation.
Ma Wenzhen said that under the current increasingly fierce international competition, many domestic high-power semiconductor device R & D and production enterprises are raising the level of localization to a new height. "Chinese chip" escort.
50% better heat dissipation substrate performance
In the conference room of Huazhi New Materials, small pieces of golden yellow are placed. Although these small pieces are inconspicuous, they play a vital role in large-scale electronic equipment.
Ma Wenzhen introduced that, taking 5G communication base stations as an example, the heat-dissipating substrate of Huazhi New Material is used in the power amplifier modules of communication base stations to provide heat dissipation, support and protection for the transmitting chip in the module to improve the long-term reliability of the chip.
A major feature of the heat sink substrate is that it has both high thermal conductivity and low stress. The junction temperature of high-power semiconductor chips will rapidly rise to about 200 ° C during operation. If there is no heat sink substrate to quickly dissipate heat, it will immediately overheat due to its junction temperature. High temperature and burnout; once the stress of the heat dissipation substrate is large, the long-term reliability of the chip will be greatly reduced at high temperatures, which will affect the device performance.
Compared with domestic traditional heat-dissipating materials, the product's heat-dissipating capacity has been increased by nearly 50%, which can reduce the chip junction temperature by 60 ° C, which is much higher than the customer's requirements for the junction temperature parameters of the transmitting base-station chip.
The reason why customers choose to cooperate with Huazhi New Materials is that Huazhi New Materials has realized the localization of high-end high-power semiconductor chip core heat dissipation substrates and maintained competitiveness in price.
Ma Wenzhen introduced that the chip industry started late in China. As a chip cooling substrate in one of the supporting industrial chains, the domestic foundation is weak. With the continuous development of technology research and development levels of domestic leading enterprises such as Huawei, Huazhi New Materials, which has the ability to localize key thermal substrates for chips, has been favored by customers in many semiconductor fields.
Huazhi New Materials attracts customers not only for chip heat dissipation substrates with excellent thermal conductivity, but also for rapid mass production.
Relying on the cost advantage of the heterogeneous material precision thermal bonding technology pioneered by Huazhi New Materials in China, the production and supply cycle of heat dissipation substrates has been greatly shortened, and the yield rate has been increased from 60% of traditional processes to 98% now. Similar products fell by about 40%.
"Compared with our foreign counterparts, we also have the advantage of late development." Ma Wenzhen said that because foreign counterparts started early, re-introduction of new technologies on the production line required huge costs, coupled with the lack of competitors and lack of motivation for upgrading. Most of them still use the technology of the 1990s.
On the other hand, communication base stations, as an important infrastructure in modern society, will be installed in a variety of natural environments, spanning the hot Sanya region and the cold northeast region. In order to protect fragile chips, this requires a heat sink substrate. Also pass the most stringent reliability tests.
In the reliability test of the communication base station users, Huazhi New Material's heat-dissipating substrate has not experienced problems in receiving 5,000 temperature shocks, which shows strong reliability. "General civilian equipment, such as mobile phones, are considered qualified after receiving 1,000 temperature shocks," said Ma Wenzhen.