On May 21st, Chinese leading Direct bond copper (DBC) substrates and high thermal conductivity alumina ceramic substrate manufacturer CDWS Electronic Ceramics Technology Group announced that the company will hold the 17th meeting of the third board of directors on May 20, 2021. It was reviewed and approved. The "Proposal on Foreign Investment of Holding Subsidiaries" was approved. In order to further meet the market demand for copper-clad ceramic substrate (DBC) products, it is planned to use its own funds and self-raised funds totaling no more than 100 million yuan to invest in the construction of a new production base.
CDWS is a high-tech enterprise specializing in precision and high thermal conductivity ceramic substrates and Direct bond copper (DBC) substrates. The main products are: 96% alumina ceramic substrate, DBC ceramic copper clad laminate. Alumina ceramic substrates are widely used in: power electronic modules, semiconductor refrigeration substrates, COB flip-chip ceramic circuit boards, LED packaging and lighting, ceramic thick film substrates, automotive inverter systems, military and aerospace products and other scientific and technological fields.