HZDH Precision Technology Group is a diversified Sino-Japanese joint venture. It manages more than 30 companies in China and globally, providing domestic and international customers with world-class materials, devices, equipment and system solutions. It has built a global marketing network, and has established companies and offices in China, Japan, the United States, Germany, France, Italy, Spain, Russia, South Korea, Malaysia and some other places. It is a multinational group with a number of high-end production technologies.
HZDH is an internationally renowned supplier of semiconductor products and solutions. It is engaged in the research, development, manufacturing and sales of ferrofluidic sealing parts, semiconductor silicon wafers, thermoelectric semiconductor cooling materials and devices, semiconductor quartz products, precision ceramics, semiconductor vacuum feedthroughs and large chambers, solar power generation materials, electron beam evaporation and coating machines.
The products cover a wide range of application fields: electronics, semiconductors, mechanical processing, solar power generation, automotive/new energy vehicles, aerospace, household appliances and medical equipment, etc.
DBC & AMB Power Electronic Substrates
HZDH offers Power Electronic Substrates for heat dissipation and insulation that using manufacturing technology from our thermoelectric module production. We offer options for Active Metal Brazing (AMB) and Direct Bonded Copper (DBC) substrates.
Thermoelectric Module Manufacturing Technology Enables Solutions for Heat Dissipation and Insulation Substrates
Generally, organic and metal substrates are used in the circuit boards of low-power home appliances and computers. However, higher power applications need substrates that with better thermal properties to operate efficiently.
Ceramic substrate materials, like alumina, aluminum nitride and silicon nitride substrates, are used in the heat radiation insulated boards of power modules that handle high power. In particular, silicon nitride substrates can be particularly useful in the power modules of inverters and converters in HEVs and EVs.
Direct Bond Copper (DBC)
Al₂O₃ DBC (ZTA) alumina
Al₂O₃ DBC (Ag) alumina
Al₂O₃ DBC (Au) alumina
Al₂O₃ DBC alumina
Active Metal Brazing (AMB)
SiN AMB (Au) Silicon nitride
SiN AMB (Cu) Silicon nitride
SiN AMB (Ni) Silicon nitride
SiN AMB Silicon nitride
The advantages of DBC
Good mechanical strength
Good thermal conductivity
Good insulation
Performance advantages of DBC
Good thermal stability
Coefficient of thermal expansion close to silicon
Like a PCB board, all kinds of graphics can be timed
DBC application field
HZDH has more than 20 years of DBC production experience, and the product quality is close to the international leading level. It can provide products with different parameters according to customer requirements. Widely used in semiconductor refrigerators, electronic heaters, high-power power semiconductor modules, power control circuits, power hybrid circuits, smart power components, high-frequency switching power supplies, solid state relays, automotive electronics, solar panel components, telecommunications dedicated switches, Receive systems, lasers and many other industrial electronics fields.