SZDS Precision Industry Group is a leading worldwide technology partner providing critical components for IoT intelligence, with a special focus on Telecommunication Equipment and Metal Precision, LED technologies and Interconnect solutions.
SZDS is the global top 3 player in the FPC industry.
Customer Reference:
Apple[iPhone, Apple Watch, Airpods products].Tesla,Huawei,
With cutting-edge production facilities and advanced technology, we constantly deliver state-of-the-art products and quality services. Our global network of research bases and offices keeps us abreast of the latest tech breakthroughs, so we can effectively allocate resources wherever they 're needed. With an established presence in mainland China, Taiwan, South Korea, Finland, India, Sweden, Germany, Poland, Estonia, the US and Mexico, we meet customer needs quickly and competently, providing sales locally in addition to customer service and warehousing capabilities.
Products
FPC/FPCA
Flexible Circuits
Single Layer to Multi-Layer
Flexible Printed Circuits (FPC) fabricated on Polyimide dielectrics with copper conductors
• Adhesive and adhesive-less materials
• Thin dielectric materials
• Thin copper (5μm, 9μm, 12μm and up)
• Static and dynamic bending
• Signal integrity and high frequency
• Via interconnects (micro/blind/buried)
• HDI features
• Single Sided FPC to Multilayer FPC
Flexible Circuit Assembly
Single Sided and Double Sided Assembly
• FPC High Density Component Assembly
• Solder attached chips (01005 and above)
• TSOP, QFP, QFN, LCC, LGA, FBGA etc, solder attached
• Fine pitch IC chip bonding with ACF
• Bare die on flex attachment (gold ball bonding)
• Unique component package attachment
Flexible Circuit Module Assembly
Module Level Assembly
• Flex circuit assembly to plastic or metal frames & housings
• Custom bending & forming
• Specialized components
• In-circuit and functional testing
• LCD Modules, Camera Modules, Touch Modules and more
Rigid Printed Circuit Board
It can mass produce PCBs with up to 48 plus layers using high-speed/low-loss capability materials for telecom and other applications.
Our Multiple-Layer Rigid PCBs, including High Layer-count boards, offer a variety of features including but not limited to:
• High-Density Interconnect
• Advanced thermal management features such as COIN technology
• 1n1, 2n2, 3n3, with VIPPO, precision depth backdrill and fill 1n1, 2n2, 3n3
• OSP and selective hard Au, immersion silver and tin finishes
• Min hole size <0.35mm
• 14:1 aspect ratio
To satisfy increasing product and sub-system requirements that span across all major consumer, telecom, commercial, and industrial market segments.
Flexible Printed Circuit
Flexible printed circuits offer a broad array of physical and electrical interconnect solutions that cannot be achieved with rigid PCBs.
It is an industry leader in materials conversion, fabrication, and component assembly to flexible printed circuits. Our annual production exceeds millions of square feet of single, double-sided, and multi-layer FPC. We have decades of experience processing a wide variety of flexible materials and can to rapidly customize solutions to meet your requirements, including:
• Single, double, and metal layer flex circuits and assemblies
• Thin copper including Adhesive-based base laminates
• Line width and spaces:> 250 um to 50 um
• Photolithography for primary images
Rigid-Flex PCB
With the revolution in portable devices, Rigid Flexible Circuits have become a preferred design solution for complex, advanced component demands.
• Standard Rigid-Flex provides a cost-effective alternative to rigid PCB modules and Flexible Printed Circuit interposers/connector systems used for low to mid-range consumer electronics products.
• It integrates conventional plated through-hole and microvia interconnect processing for intermediate component density designs to give the best Rigid-Flex solutions.
• We also offer more advanced serpentine FPC designs, including Rip-StopTM technology, as a part of our Rigid-Flex solutions.
• Moreover, stiffeners, air gap construction, shielding, and coverlays from our low-cost FPC systems are also available.
PCB Assembly & Box Build
It offers full assembly services from PCBA/FPCA through to final Box Build, including Surface Mount Technology, backend and verification processes.
• It offers full assembly services from PCBA/FPCA through to final Box Build.
• Our Surface Mount Technology lines, co-located backend processes, and highly-rigorous verification give customers of all sizes the greater ease, speed, and accountability of dealing with only one supplier from PCB to final product.
• Whether your assembly needs are for high-mix products or demand highly-technical expertise in understanding printed circuit technology, Multek provides the superior level of service you would come to expect from a strategic partner.
Metal Precision Parts and Components
Base Station Antenna
RF Filter
Technical Ceramic
Die-casting & CNC & Thermal
Heat Sink Frame for Telecom (Indoor)
Heat sink frame for In-door systerm is used for cool down the indoor used 5G high frequency system and also provide shelter for them.
• Big casting tonnage for huge thermal capacity
• Localised high efficient thermal solution – Embedded heatpipe
• Overall high efficient thermal solution – Fin-bonding process
Smart Combiner Chamber
Smart combiner is one kind of filter that merges mutiple channels into a single one that can be used for an Access Point (AP), a WLAN, or for other signals.
• Tiny size
• Band eliminate filter, smartly switch frequency bend
• Hole diameter accuracy ±0.02mm, when hole depth is 200mm
• Good plating quality, stable filter function
• Operating Frequency: DC-690 ~ 862 MHZ / 880 ~ 960 MHZ
Heat Sink Frame for Telecom (Outdoor)
When high frequency signal and microwave feed into the circuit, it will inevitably generate heat, and with increased 5G equipment frequency, it will produce more heat. 5G filter Heatsink for Telecom is used for cooling the filter and to improve heat dissipation.
• High fin height (120mm) with big extrusion size
• Use FSW technology to combine four extrusion parts together to save cost
• 100% air-proof
Fin-bonding Heat Sink for Telecom
When high frequency signal and microwave feed into the circuit, will inevitably generate heat, Fin-bonding Filter Heat Sink and HTC Al application will improve the thermal performance significantly.
• Material: High thermal conductivity (HTC) aluminum (>170W/m.k)
• Fin-bonding process for high fin requirement which die-casting can not meet
• Pull force for fins can meet average 2KN
• Copper plate inside cavity to improve thermal performance on specific area
MCU for EV
MCU for EV is short for Motor control unit build for EV cars, with high accuracy & speed monitor V-I for energy, also with high efficient E-motor control.
• Tiny size, High power density
• High intergrated and cost efficient
• Development Platform for automotive grade products
VCU for EV
VCU for EV is short for Vehicle Control Unit built for EV cars. As the core control unit of the vehicle, it monitors and communicates the various modules of the vehicle.
• Optimized size, three-in-one design
• IP67 protection
• High efficient thermal MGMT – liquid cooling
• Stable running
Heat Sink for EPS control unit
The heat sink of ECU for EPS system.
• High strict cleanness requirement, no more than 0.01mg per area
• High accuracy hole position ±0.005mm
• No any deformation for the thread holes
• All diameters controlled by die-casting mold for cost efficiency
Automobile Pillar Loop
Automobile Pillar Loop is a bracket for seat belt spindle, applied in BMW vehicle.
• High strict surface requirements, no grain afterplating
• High accuracy hole position ±0.005mm
• Gorque strength for thread hole greater than 55Nm, ppk> 1.0
• Pull strength for thread hole greater than 17kN, ppk> 1.0
eFUSE HS frame for EV
eFUSE HS frame provides assembly and shelter for EV car eFUSE chip/unit.
• Optimized size, low cost
• Thin/high/thick fins, good thermal efficiency
• IP67 protection
• Good insulation effect
Sheet Metal
Precision Stamping parts
…