The special composite material developed by TWJC's patented technology-CMW-Copper Magnetic Wafer and the exclusive patented vertical LED structure and process can solve the problem of low yield and flip chip of Mini/Micro LED without substrate mass transfer The dilemma of insufficient luminous brightness and uniformity has achieved the goal of low-cost and high-brightness, and has greatly promoted the popularization of Mini/Micro LED applications.
The CMW-Copper Magnetic Wafer developed by TWJC has the following four characteristics:
1. Magnetic attraction: The material itself is not magnetic, but has magnetic characteristics, which is beneficial to the subsequent high-speed mass transfer process;
2. Ultra-thin thickness: The thickness can be as thin as 30um (micrometer), and the chip size is reduced to achieve miniaturization;
3. Chemical cutting: Through chemical cutting, the output of a wafer can be doubled due to the fine cutting;
4. High heat dissipation: The material is metal, which has excellent heat dissipation.
Using CMW-Copper Magnetic Wafer as the substrate of the LED light-emitting layer can enhance the strength of Mini/Micro LED chips, and the chips can also be made into a vertical structure to make the brightness and power consumption performance more excellent.
On this basis, TWJC has also developed copper magnetic micro-light-emitting diodes (CMuLED) and Micro LED 0404 RGB top face emitting package (0404 Pixel Top Face Emitting Package, 0404 TFE for short).
In addition, TWJC released the entire Mini/Micro LED product line, allowing Mini/Micro LED related products to break through the threshold of mass production and low yield, and promote the development of the entire industry chain.