We all know that copper is very afraid of oxidation, but now Chinese researchers have found innovative solutions to the problem.
According to a new paper in the world's top academic journal Nature, the team of Professor Zheng Nanfeng and Fu Gang of the School of Chemistry and Chemical Engineering of Xiamen University and the team of Professor Jiang Ying of Peking University have proposed a surface coordination anticorrosion technology for copper materials. The copper wears a unique "protective suit", which can effectively realize the anti-oxidation of copper materials of various scales from copper foil to copper nanowires and copper nanoparticles.
According to the report, the scientists deposited copper ions on the pre-formed ultra-thin nickel hydroxide nanosheets. Under the condition that there is a large amount of formate in the solution, the hydroxide nanometers with rich copper ions on the surface and coordinated with formate are formed. sheet.
Subsequently, in the subsequent heating process, the surface coordinated formate radicals gradually reduce the surface copper ions to cuprous oxide to metallic copper, and finally copper-nickel hydroxide composite nanosheets that can be stable in the air for several months are obtained.
The research believes that the copper anti-oxidation and anti-corrosion technology can be applied to the preparation of copper foil, copper wire, copper nanomaterials, and can be applied to fields such as transparent conductive electrodes and printable conductive pastes.