NBBW Alloy Technology Group, as a leading high-end alloy material enterprise in China, has been focusing on the alloy material field, constantly developing "high, precise, sharp" alloy materials, and continuously providing professional application solutions for customers. Since its establishment in 1993, it has currently owned 198 domestic and foreign invention patents. At the same time, a number of domestic and foreign invention patents are being declared and approved. This continuous scientific research and innovation capability promotes the development of modern manufacturing to high quality.
The 2020 Shanghai Electronics Show in Munich will be held as scheduled from July 3rd to 5th. NBBW will show its key products and propose solutions to the pain points of 5G communications, 3C electronics, automotive electronics and other application development.
NBBW related personnel specifically mentioned that the new product high-performance copper alloy connector material brought this time can meet the market demand for strength and conductivity alloys.
The application of 5G era has the requirements of "low latency and low power consumption", which requires connector materials to have better transmission efficiency, and at the same time conforms to the development trend of electronic connectors "miniaturization, high current, high temperature rise", NBBW independently developed The high-performance copper alloy connector material is an environmentally friendly high-performance tin-nickel-silicon-copper alloy. The alloy is strengthened by solid solution strengthening, aging strengthening, fine grain strengthening, and work hardening. Compared with ordinary phosphor copper on the market, There are four major advantages:
a. Good conductivity: The conductivity can reach 35% IACS, which is 2.5 times that of the common connector material C5191, 1.3 times that of C42500, and the temperature rise is only half of C5191, which can effectively reduce the connector terminal heating and meet the high current , Fast transmission and small temperature rise;
b. Good resistance to stress relaxation: under 50% Rp0.2 load, the stress retention rate of boway42300 after 1000 hours of test is 71%, which is 10% higher than C5191, which can provide reliable contact for a long time under high temperature environment;
c. Excellent corrosion resistance: In the neutral salt spray test, green rust spots containing a large amount of copper chloride appeared on the surface of C5191 within 72 hours. But the corrosion depth of this material is shallow, and the entire surface is very good. Meet the application requirements of products under harsh working conditions;
d. The high-performance tin-nickel-silicon-copper alloy has excellent high-temperature softening resistance: after 5 hours of testing at 400℃ high temperature, the hardness of C5191 has decreased by 33%, and the hardness of high-performance tin-nickel-silicon-copper alloy has only slightly decreased , To improve the stability and reliability of the material under high temperature conditions.
This high-performance tin-nickel-silicon-copper alloy can meet the performance requirements of electronic and electrical system connectors, and has high application value in the field of connectors. It can replace the existing mainstream material C5191 and is widely used in consumer electronic connectors and automobiles. Connector and other industries.
In addition to this high-performance tin-nickel-silicon-copper alloy, NBBW has also brought copper-nickel-phosphorus alloys, copper-chromium-zirconium alloys, precipitation-strengthened precipitation alloys and other high-performance series alloy materials. To achieve the reliability and stability of materials in complex environments, so that connector products win on the "starting line".
Take the "5G" Dongfeng, increase investment in research and development of related materials
Since March, the country has proposed to accelerate the pace of new infrastructure construction, which has a great impact on the entire electronics industry. "This is a good time for China's manufacturing industry to move towards the top ranks in the world. Only companies that can grasp the opportunity and seize the opportunity can be at the forefront of the industry. NBBW has invested a lot of time in the development of related materials, such as copper nickel phosphorous Alloys, copper-chromium-zirconium alloys, etc. have excellent properties such as high transmission, anti-interference, and high heat dissipation, and can meet the development needs of "large current, high transmission speed, and miniaturization" in global 5G communications, smart terminals, consumer electronics and other industries.
Copper-nickel-phosphorus alloy solves 5G terminal heating
"In the 5G era, the transmission volume of streaming media signals is very large, and the corresponding chip processing capacity is correspondingly large, which also leads to a serious problem: the components generate a lot of heat." Powerway Alloy pointed out that if the heat problem cannot be solved well, 5G mobile phones Performance will be severely affected.
The challenge brought by the development of 5G is the temperature rise of the device after high transmission. The liquid-cooled heat sink device represented by the VC temperature equalization plate has become one of the important solutions to the heat dissipation of 5G. Faced with the trend of thinner and lighter mobile phones, the thickness design of the temperature equalization plate gradually reduced from 0.4mm to 0.3mm and below. The ultra-thin design puts forward higher requirements on the strength of the material after high temperature treatment and the flatness after etching processing . In response to this application pain point, Powerway Alloy spent 3 years with the top domestic mobile phone manufacturers to develop a VC average temperature plate material copper-nickel-phosphorus alloy. The copper-nickel-phosphorus alloy can reduce the chip temperature by 2°C, which greatly improves the user's grip and comfort when using the device, at the same time increases the reliability of the device and effectively solves the heat dissipation problem of the 5G terminal.