Tokyo, December 12, Dai Nippon Printing Co., Ltd. (DNP) has successfully developed a photomask manufacturing process capable of accommodating the 3-nanometer (10-9 meter) lithography process that supports Extreme Ultra-Violet (EUV) lithography, the cutting-edge process for semiconductor manufacturing.
In doing so, we are responding to the need for ever finer circuit line widths in line with the shift to high-performance in the logic semiconductors used in smartphones and data centers.
Source:DNP