Midland, Michigan, USA, January 17, 2017-Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced three new highly reflective silicone coatings, further enriching Dow Corning’s fast-growing LED innovation solutions Product portfolio. These three products greatly enhance the design flexibility of LED package manufacturers. They are not only suitable for the design of high-end LEDs such as chip size package (CSP) and chip-on-board package (COB). They also provide from traditional dispensing methods to new printing. Methods for multiple processing scenarios.
These three new silicone coatings are WR-3001 mold edge coatings, WR-3100 mold edge coatings and WR-3120 reflective coatings, all of which belong to the Dow Corning® brand. To match customers’ diverse process needs, Dow Corning will continue to launch new products.
Takuhiro Tsuchiya, Global Marketing Manager, Dow Corning, said, “Manufacturers are actively exploring smaller, more efficient and more cost-effective LED package design solutions, so advanced new reflective materials are needed to help evolving applications such as printing , And responding to increasingly stringent operating conditions. The introduction of these three new silicone coatings is just the beginning. We will continue to develop a series of new coating products for the industry. Dow Corning has always been committed to actively promoting various cooperative innovations. These three reflective silicone coatings help customers overcome today’s biggest design challenges and allow them to provide highly reliable and differentiated products in the highly competitive LED market. “
Like other Dow Corning reflective materials, these three coatings maintain high reflectance at low thicknesses and maintain their performance at 150 ° C, while many other organic coatings crack and yellow at 150 ° C. . In order of hardness from low to high, the three new products are:
WR-3001 mold edge coating: It has excellent light and heat stability, is dedicated to high power chip size package (CSP) applications, and is suitable for traditional dispensing processes.
WR-3100 mold edge coating: Dedicated to chip size package (CSP) applications and low and medium power LED package design, and suitable for traditional dispensing process; its cured hardness is as high as 65D, which can be used in chip cutting process.
WR-3120 reflective coating: WR-3120 is the product with the highest hardness and reflectivity among the three new products, and has high light and heat stability. It is suitable for high-power LED packaging applications and printing processes, which can improve the performance of LED equipment.
Dow Corning is a market leader in LED lighting materials, technology and collaborative innovation, providing solutions that cover the entire LED value chain, helping to more reliably and efficiently package, protect, adhere, cool and mold LED lights for all lighting applications .