Dow recently launched a new DOWSIL TC-3065 thermal gel. DOWSIL TC-3065 is a one-component thermally conductive gel that can effectively dissipate heat from sensitive electronic components. Due to its excellent wetting ability, DOWSIL TC-3065 thermal gel can easily fill gaps and can replace prefabricated elastic thermal pads. These thermal pads may not protect electronic devices from the high heat caused by 5G greater power density. When fully cured, this thermal gel eliminates silicone oil bleed and has very low VOC emissions. In order to improve production efficiency, DOWSIL TC-3065 thermal gel supports automatic sizing and thermal curing after assembly. Applications of this innovative material include telecommunications and data communication equipment.
Samuel Liu, marketing manager and head of the communications department at Dow Chemical, said: "5G technology's thermal interface materials require rapid heat dissipation, and electronic equipment manufacturers also need advanced material solutions to support sustainable development and efficient assembly. The new DOWSIL TC -3065 thermal gel balances various properties well and can meet various requirements. Dow continues to expand its thermal conductive silicone gel product portfolio, and the newly developed high-performance thermal gel helps to achieve a high efficiency and environmental protection Way to promote the development of a new generation of applications."
DOWSIL TC-3065 thermal gel is a soft stress-relieving and shock-absorbing silicone gel with a thermal conductivity of 6.5W/mk. It has a high extrusion rate (60 g/m) and supports automatic sizing. DOWSIL TC-3065 thermal gel can prevent sagging during vertical assembly and can completely fill uneven spaces. The thermal gel can accommodate larger tolerances between parts, which may pose challenges for the manufacture of prefabricated thermal pads with limited dimensions. The thermal gel exists in the form of a non-flowable gel, which can support a thickness of 150 microns when a high pressure is applied.
DOWSIL TC-3065 thermal gel can be applied to substrates such as aluminum heat sinks and encapsulated chips with epoxy materials on the surface. After assembly, the thermal gel can be fully cured by heating at 100°C for 30 minutes (or at 80°C for 60 minutes) or using heat generated by electronic components. If rework is required, DOWSIL TC-3065 thermal gel can be completely removed, and no residue will be left after curing. At room temperature, the working time or applicable time of the thermal gel is usually 5 days, which helps to reduce the scrap rate in the electronic assembly process.
DOWSIL TC-3065 thermal gel balances adhesion and reworkability well, supporting advanced technologies that require reliable performance. Unlike some elastic thermal pads, this new thermal gel will not ooze silicone oil after it is fully cured, thus helping to avoid contamination of the device surface and lower device performance. DOWSIL TC-3065 thermal gel is resistant to moisture and other harsh environments, and will not crack during long-term aging. It can be used for optical transceivers, Ethernet switches and routers, high-speed solid state drives and other network equipment. The thermogel is sold globally by Dow Chemical and its extensive network of distributors.