Dymax, a leading manufacturer of fast light-curing materials and equipment, recently launched the light-curing Low Shrink OP-81-LS epoxy resin. The product is cured within a few seconds under the irradiation of broad-spectrum light energy to achieve fast and accurate optical component assembly.
Dymax recently launched the light-curing Low Shrink OP-81-LS epoxy resin. The product is cured within a few seconds under the irradiation of broad-spectrum light energy to achieve fast and accurate optical component assembly.
The volume shrinkage of OP-81-LS during curing is very small, and the coefficient of thermal expansion (CTE) is low, so the displacement during temperature changes is small. The material meets the ASTM E595 thermal vacuum outgas standard, which is very suitable for the positioning and bonding of lenses, prisms, optical fibers or other optical components. Because the product can only cause the polymerization reaction to complete curing under light irradiation, the manufacturer has sufficient operating time to accurately align the assembled parts and then cure.
OP-81-LS has the characteristics of low temperature (80-85 degrees Celsius) heat curing, which can solve the pain points of curing in shadow areas that are not exposed to light or products that are not suitable for high temperature heating. The material is solvent-free, single-component, and does not require mixing. The low shrinkage OP-81-LS is very suitable for the bonding of dissimilar substrates in the assembly of consumer electronics, and has good adhesion to polycarbonate (PC), glass, acrylic and metal surfaces.