Electrolytic copper foil refers to the metal copper deposited layer obtained by electrodeposition technology under the action of a certain current density in an electrolytic solution. It is an important material for manufacturing copper clad plates (CCL) and printed circuit boards (PCB). The industry has high investment costs, Production technology is difficult to copy and professional talents are scarce, and the barriers to entry for enterprises are high.
At present, almost all of the copper foil for the inner layer of high-density interconnect boards (referred to as HDI) with high technical content and added value and copper foil for flexible circuit boards (referred to as FPC) are imported from Japan and South Korea.
Market size forecast
According to public data, the total domestic electrolytic copper foil production capacity reached 453,400 tons in 2018, and it is expected that by the end of 2019, the total domestic electrolytic copper foil production capacity will reach 582,400 tons. It is expected that by 2022, the market size of the domestic copper foil industry will reach 50 billion yuan.