Evonik launched two photosensitive resins INFINAM® TI 3100 L and INFINAM® ST 6100 L for industrial 3D printing applications. These two materials are suitable for common photopolymerization processes (VAT polymerization) such as light curing molding (SLA) and digital light processing (DLP). Thus, Evonik's new polymer resin product line was officially born. Evonik will publicly showcase its new products for the first time at the 2021 Asia 3D Printing Additive Manufacturing Exhibition (TCT Asia Exhibition) to be held in Shanghai from May 26 to 28.
Dr. Dominic Störkle, Head of Evonik's Additive Manufacturing Innovation and Growth Area, said: "The launch of this new product line means that Evonik has officially entered the light curing technology market. This move will help us in all mainstream polymer-based 3D printing The technical materials market has maintained a professional advantage for a long time. Through the new ready-to-use material formula, we will continue to promote the material strategy, so that large-scale 3D printing technology can be widely used in the entire value chain."
The new photosensitive resin product line was announced
As the first high-performance material in Evonik's photosensitive resin product line, INFINAM® TI 3100 L can be used to manufacture 3D printed parts with extremely high strength and good impact resistance. Thanks to a good combination of characteristics, INFINAM® TI 3100 L can be used to produce industrial components based on SLA, DLP and other photopolymerization processes. According to the test, the impact resistance of the components printed with this new material is 30 J/m3, and the elongation at break is as high as 120%, so it can withstand permanent mechanical effects such as strong impact or stamping. INFINAM® TI 3100 L is suitable for a variety of specific applications in the industry, automotive parts, and consumer goods industries. It can not only meet the needs of design freedom, but also cope with the high mechanical load in the use of goods.
INFINAM®ST 6100 L is expected to fill the gap in demand for high-strength photosensitive resin materials. INFINAM®ST 6100 L has a tensile strength of 89 MPa, a flexural stress of 145 MPa, and a heat distortion temperature (HDT) of 120°C. Thanks to these characteristics, this material is very suitable for applications that require high temperature resistance and flexural strength.
Dr. Rainer Hahn, Head of the Photosensitive Resin Segment of Evonik's Additive Manufacturing Innovation Growth Field, said: "INFINAM® TI 3100 L and INFINAM®ST 6100 L mark the official launch of Evonik’s first batch of photosensitive resin materials. Our R&D staff Possessing a wealth of chemical expertise has provided key support for the development of new materials, thereby bringing distinctive products with outstanding performance to the market and helping customers develop new application areas."
INFINAM® photosensitive resin for SLA and DLP processes
The new photosensitive resin product line is a high-performance ready-to-use material formulation that can be directly used in various common SLA and DLP printers on the market.
Evonik's additive manufacturing innovation growth area brings together the group's internal 3D printing technology expertise, focusing on the development and manufacture of high-performance ready-to-use materials suitable for common 3D printing processes. In this context, Evonik has recently adjusted its ready-to-use 3D printing material product portfolio and created a new brand INFINAM®. For Evonik, cooperation with customers and industry partners is an important innovation driver.