Laser structuring of flexible circuit board
The UV laser device imported from Germany adopts UV-DPSS laser device,being able to process FPC structuring,FPC micropore drilling,FPC blind hole drilling,high polymer material cutting ,LTCC low temperature Co-fired ceramic circuit board cutting and drilling,application of high-precise component structuring and so on.
The technology application process is automatic during the whole process,owning the characteristic of being high-precise,high-efficient,high-quality,low carbon and environment friendly,setting a precedent in the innovation of UV laser application technology.
FPC cutting and drilling
Changing the traditional cutting craft with contour cutting,drilling,and dielectric layer removal by direct laser processing of complex FPC.
Cover layer cutting for flexible PCB
Adopting UV laser cutting,without any deformation and carbonization.
Different shape and size processing.
Smooth and neat side walls.