On November 30, 2020, Smiths Interconnect, a global semiconductor test solution provider, released a new Volta180 test head to expand the Volta product line, supporting the market’s acceptance of smaller pitch wafer sizes, wafer-level chip packaging and known qualified chips (Known Good Die) test requirements. The Volta product series is an enhanced solution from Smiths Intercom, which can quickly and reliably test wafer-scale packages and wafer-level packages with a minimum lead pitch of 180um to ensure that they meet specifications and meet end product application performance.
The new Volta180 series pin minimum pitch (PITCH) is reduced to 180um, which is an enhanced wafer-level test solution with the following performance advantages:
Volta 180 can maintain low and stable resistance even after 750,000 cycles of life test, thus providing high-precision measurement. Excellent needle coplanarity can meet 64 stations, and 5000 probes can be tested at the same time to improve production efficiency. Modular needle design can ensure quick replacement during maintenance and almost zero downtime. The full probe array design allows the probe position to be configured according to different products on site, so that a single Volta 180 probe head can test multiple products.
About Smiths Interconnect
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems and radio frequency products that connect and control critical applications in the commercial aviation, defense, space, medical, rail, semiconductor test, wireless telecommunications, and industrial markets.
Smiths Interconnect's technology brands (EMC, RF Labs, Lorch Hypertac, IDI, TRAK, TECOM, Millitech, Sabritec, HSI and Reflex Photonics) are synonymous with exceptional performance and quality solutions for reliability and safety and offer the combined capabilities and product solutions of its nine technology brand origins. Our extensive product portfolio includes high reliability electrical interconnect solutions, solutions for antenna systems and a wide range of innovative RF and microwave solutions.
They are synonymous of exceptional performance when critical applications require a technologically advanced, high quality, multi-pin electrical connection and a wide range of innovative RF and microwave solutions to ensure reliability and safety.
Smiths Interconnect is part of Smiths Group, a global leader in applying advanced technologies for markets in threat and contraband detection, energy, medical devices, communications and engineered components. Smiths Group employs around 22,000 people in more than 50 countries.