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Global leading Copper foil for electric vehicle batteries, Ultra-low-illumination copper foil, Ultra-thin foil manufacturer and supplier Hay:A03SKDS

SKDS supplies high-end copper foil

based on foundation technique of ultra thin foil and coating.

Copper foil is used in various electronic equipment, and the core technology is to make the surface smooth and thin.

SKDS steadily enhance the competitiveness in the global market based on 60 years` of manufacturing experience and know-how.

Main Products

Copper foil for electric vehicle batteries(SR-PLSP)

High-elongation electrolyte copper foil

Applied to next-generation lithium-ion batteries for electric vehicles (Cylinder/square type)

Thickness: 6~12um

Ultra-low-illumination copper foil(BF-NN)

Low surface roughness

Stable peel strength (over 0.5N/mm) at roughness of below 0.9um (JIS standard)

Used for data sensor, etc. with low Insertion loss even at 77Ghz

Thickness: 9~70um

Ultra-thin foil

The 1.5um~5um thin product can be used for IC Packaging and HDI application.

Can be used for Modified Semi-Additive Process, applicable at Line Space of 30/30um and below.

Thickness: 1.5~5um

Ultra-low-illumination copper foil.jpg

Technology Strength

Holding copper foil technology for 5G that can minimize signal loss

Copper foil for low signal loss that minimizes signal loss using the technology of forming less than 1.0um illumination (Based on Rz JIS); applied to network applications such as 5G

High-end copper foil for electric vehicle batteries with high strength/high elongation

Secured copper foil implementation technology for high-strength, high-elongation batteries and thin foil mass production that can satisfy the manufacturing methods and requirements of various battery customers

Holding the world`s leading thin foil manufacturing technology

Manufacturing less than 2um ultra-thin foils, having manufacturing methods suitable for making high-end PCB (Electronic circuit board) micro-circuit, highly sensitive and integrated, and multi-layered

Holding copper foil technology for the IC/USIM card

Providing copper foils suitable for IC cards and USIM cards using special surface treatment technology to prevent damage from external environment such as moisture, including copper foil manufacturing technology with high strength and high elongation

Product applications

For high-frequency circuits(Antenna, Etc.)

For IC and USIM cards

Flexible substrate(Smart phone, Etc.)

High-speed digital transmission& low loss (5G communication equipment,base station radar, Etc.)

Lithium-ion battery(for electric vehicles)

High-performance multi-layered board(Network board)

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