With the upgrade requirements of 5G for electronic hardware components, the degree of integration and assembly density of electronic components continue to increase, and the power consumption and heat generation of equipment have increased dramatically. Relevant experiments show that the power consumption of 5G mobile phones is more than 2 times higher than that of 4G mobile phones, which puts more stringent requirements on thermal conductive materials.
The USHY Electronic Materials Division, which has been cultivating thermal materials for nearly 20 years, has aimed at this trend. Relying on the polymer matrix and thermally conductive patented technology, it is the first to lay out high-performance thermal interface materials.
The thermal interface material is a material commonly used in IC packaging and electronic heat dissipation. It is mainly used between the heat source and the heat sink to fill the micro-voids and uneven surfaces generated when the two materials are in contact, thereby eliminating air and improving the heat dissipation of the device. Performance, to ensure the normal operation of integrated circuits and chips.
According to BCC Research forecast, the global thermal interface material market size will increase from 760 million US dollars in 2015 to 1.1 billion US dollars in 2020, a compound growth rate of more than 7%.
With the impact of 5G on the downstream market, the related industries of thermal conductive materials will definitely bring huge incremental demand. Thermal conductive materials companies with thermal solutions and R&D and design capabilities may stand out from the 5G supply system and play a more prominent role The role of the industry chain.
Although the blue ocean of thermal interface materials has arrived, not everyone can become a chaser. With the gradual improvement of device integration, low-end thermal interface materials such as 2W or 3W on the market have been difficult to meet the upgrade needs of modern electronic equipment. It is reported that the demand for high-wattage thermal conductive materials is increasing day by day.
But as the thermal conductivity increases, the application performance and long-term reliability of the material will decline. The thermal interface materials on the market often have oil leakage and overflow phenomena during use. The gels with high thermal conductivity have oil powder analysis under high pressure, etc., which brings huge production to the quality, long-term reliability and stability of the terminal products. risk.
The thermal interface material of USHY can still maintain stable and reliable thermal conductivity in harsh environments such as high temperature, high humidity and thermal cycling, and is well-known in the industry. Chen Guanyu, general manager of USHY believes: "The technical foundation behind USHY high-quality thermal conductive materials is on the one hand the surface treatment and production of special metal and ceramic powders, on the other hand is the design of polymers."
USHY's thermal interface materials include thermally conductive phase change material (PCM), traditional thermally conductive gasket (TGP), ultra-soft thermally conductive gasket (PT), thermally conductive insulating gasket (TIP), thermally conductive silicone grease (TG), dispensable Thermal conductive gel (HT&HLT) and other thermal conductive materials with different characteristics.
USHY thermally conductive phase change material
USHY's thermally conductive phase change material (PCM) has two forms: patchable sheet and printable paste. After heating, the phase change viscosity becomes lower and the ductility is improved. It can completely fill the gap of the contact surface. Because of its excellent reliability and stability, it replaces traditional silicone grease in more and more application fields to solve the problem of silicone grease drying out. It can be applied to solve the long-term and stable heat dissipation requirements of servers, tablets, smart phones, routers, etc.
USHY thermal pad
In addition, its thermally conductive gasket (TGP) has the characteristics of low hardness and low oil permeability, good surface wettability and compressibility, can greatly reduce the interface thermal resistance, can maintain good performance in reliability testing, and can be used in consumer electronics products , Automotive electronics, power equipment and modules, semiconductor logic circuits and memory, and other products.
USHY high thermal conductivity point glue filling material
The self-dispensable single and double component gel (HT&HLT) has the characteristics of low oil permeability and low volatility. Its specially designed stable suspension system can avoid the pain point of oil powder separation during long-term storage and high-pressure application, and can be used for 5G Various applications such as base stations, solid state drives, optical modules, automotive electronics, and various consumer electronics.
The application of high-performance thermal interface materials has effectively promoted thermal conductive materials to a new milestone, but the mission of USHY is far more than that. Relying on its thermal interface materials with different characteristics, USHY is committed to proposing the best thermal interface solution based on customer needs for product life cycle and packaging design.
Due to the consistent appearance of the heat sink, downstream companies have difficulty distinguishing the quality of the material with the naked eye, leading to increased trial and error costs. To this end, USHY provides technical inspection services for enterprises to help customers understand the types and characteristics of heat dissipation materials on the market, and then recommend materials that match them according to customer demands, and finally provide more optimized designs.
In the past, USHY was positioned as a high-end enterprise material solution provider. Through continuous code development, it has improved its technical strength, and cooperated with the cutting-edge enterprises in the electronics industry to solve high-end material problems.
Nowadays, almost all consumer electronic products require thermal conductive materials. 5G commercialization has further promoted the replacement of electronic materials. The market prospect of basic thermal conductive materials is inestimable. USHY is keenly aware of the broad market prospects of basic materials, and quickly expanded its business scope to basic materials. It aims to drive the high-end market and consolidate the basic materials market.
Based on the solid R&D foundation of the team, USHY explores the chip field in depth, from thermally conductive front-end chip to back-end chip design, supplying different types of high-end materials for domestic and international semiconductor companies, helping companies promote the landing of chips.
In order to cope with the new changes brought by 5G to thermal conductive materials, USHY focuses on the layout of high-end gaskets and gels to provide high-end interface materials of 8-11W/mK that meet the high heat dissipation requirements of 5G products to solve the pain points of customers in various industries in heat dissipation .
In addition to the layout of high-end application areas, USHY also uses the low-end and middle-end thermal conductive materials required for personal consumer products as the starting point, focusing on the advantages of high cost performance. To this end, USHY provides a full range of thermal solutions for different consumer electronics application needs, combined with different product forms.
After accumulating technical experience in the low-end market, it gradually moves towards the high-end market. This kind of "thick accumulation" is common in the strategic layout of startups. USHY has nearly 400 approved and pending related patents, and has long provided thermal interface materials for cross-industry thermal management solutions. So for it, driven by the high-end market, consolidate the low-end basic thermal conductive materials.
In fact, to support USHY's layout of the full range of thermal conductive materials, in the final analysis, this company can maximize the long-term reliability of the product.
"We will be more strict than the industry in reliability experiments such as temperature and life cycle. The temperature conditions of others can be -40~85℃, we can achieve -55~125℃; the service life of others can be 1000 hours, we can Do 3000 hours." Chen Guanyu introduced.
Technology is used as a weight to promote the landing of high-end materials, and products are made; technology-based high-quality materials are built, and brands are made. It is worth mentioning that the stringent experimental requirements have created the long-term reliability of the USHY thermal interface material. This company not only maximizes its products, but also establishes a good reputation in the eyes of customers.
"Whether it is an agent or a customer, the deepest impression of USHY is true." It is understood that USHY has very strict requirements on the reliability of experimental values. Sometimes the data value is even more conservative than the real value, so the customer never doubts the test report.