In the era of 400Gbps and 5G, the thermal management of pluggable optical modules has become a very challenging task. The traditional pluggable optical module thermal interface material TIM is no longer suitable. For this purpose, Henkel of Germany has developed a new miniature thermal interface coating material BERGQUIST microTIM mTIM 1000 series, which provides a reliable heat dissipation solution for the actual needs of the latest data center applications.
Used for heat sinks of network line cards in contact with POM, this product is a reliable heat transfer to the film material, which can improve the heat transfer performance between the module and heat sink. In the 400Gb era, the power consumption per POM (each network card may be up to 32) may be as high as 15W. Very high new materials better support module heat dissipation, and the working temperature per W can be reduced to 0.33 degrees Celsius. For a 15W module, it is 5 degrees Celsius, which adds up to a considerable amount.
Wayne Eng, head of Henkel ’s global communications market strategy, said that material performance and application adaptability affect the effectiveness of heat dissipation. Unlike traditional TIM gaskets or tapes that are usually scratched during insertion and removal, Henkel's new products can support more insertions and removals and can better meet the needs of 400GbE users.
The BERQUIST microTIM mTIM 1000 series is applied on the heat sink with an ultra-thin 20-micron layer. It is a silicone thermosetting resin with excellent durability, supporting repeated insertion and removal and thermal conduction. In customer tests, more than 500 insertions and removals were achieved without affecting heat dissipation performance, which is far higher than the industry test standards. Moreover, the material is not afraid of salt corrosion, wear and vibration, and is suitable for working environments from -40 to 200 degrees Celsius.