Memory, as an important part of semiconductor components, is one of the three pillars of the semiconductor industry. It is a key part of electronic products such as mobile phones and tablets. Electronic products continue to pursue light, thin, short, small design trends and enhance memory The chip function does not increase the package volume.
Stacked chips, 1 + 1> 2 magic
The meticulously designed substrate of the memory allows the die to be stacked in a vertical configuration, thereby making the footprint smaller. Chip stacking is widely used in handheld devices and storage devices. After refinement, up to 8-16 chips can be stacked to create a high-capacity memory card.
LOCTITE ABLESTIK ATB 100MD8 is a non-conductive chip adhesive film (DAF), designed for chip stack packaging, to help the manufacture of today's memory devices. It will enable packaging manufacturers to obtain better advantages over traditional chip adhesive products: avoid chip tilt, be able to handle ultra-thin chips and better control the thickness of the adhesive layer, improve processing performance, yield and long-term reliability.
▍ Realize thin package
The thickness of the adhesive layer and the thickness of the package are thin
▍ Excellent operability
· Good Thermal Budget performance, up to 1-1.5 hours at 175 ° C
· No glue thread, no double chip phenomenon
· Stable wafer cutting and chip picking performance, suitable for thin large chip applications
· Compatible with SDBG and DBG
▍ Excellent reliability
MSL L2 / 260 ° C capability
LOCTITE ABLESTIK ATB 100MD8 excels in automated mass production. Look at the actual application process:
The current rapid development of semiconductor and packaging technology has greatly increased the demand for high performance, small size, high reliability and ultra-low power consumption of all electronic components, and it is also supported by emerging industries such as artificial intelligence, autonomous driving, 5G networks, and the Internet of Things Now, the demand for advanced heterogeneous integrated packaging is becoming stronger and stronger!
Henkel provides a series of solutions, in addition to non-conductive chip bonding film (DAF), capillary underfill (CUF), pre-dispensing underfill (NCP), and underfill film used in 3D TSV package (NCF) etc.