The power electronics packaging market is changing with each passing day, and competition is becoming more intense. As the industry has higher and higher requirements for power electronic modules, the current packaging materials have reached the application limit. Therefore, the material system must be carefully designed to meet industry requirements.
In order to comply with this trend, Heraeus Electronics, a leading material solution provider in the electronic packaging industry, has introduced matching material combinations to help manufacturers optimize the performance and reliability of power electronic modules.
"Heraeus has a long history of development and has accumulated rich material expertise and technology. We are very proud of this." said Wang Jianlong, the sales manager of Heraeus Electronics China. "As a company that provides a full range of power electronic packaging materials As a global supplier, Heraeus Electronics’ products cover bonding wires, sintered silver, substrates and other fields, so we can provide optimized and matched material combinations."
The supporting material products of Heraeus Electronics mainly include material systems such as cermet substrates, bonding wires and Die Top System (DTS).
CucorAl Plus-Combining the advantages of aluminum and copper
CucorAl Plus is an aluminum-clad copper wire that can be used on the surface of conventional aluminum chips. If CucorAl Plus is used instead of aluminum wire in the existing module design, the service life of the power module can be extended by 4 times. In addition, with the help of CucorAl Plus, engineers are also expected to design new models with higher power density (current-carrying capacity and fusing current are 20% higher than aluminum wires), and operating temperatures up to 200°C (higher temperature mechanical stability is better than aluminum wires) A generation of power modules.
Die Top System-the perfect combination of bonding copper wire and sintering process
Heraeus Die Top System (DTS) is a material system composed of the following parts: a copper foil surface with bonding function, pre-coated sintered silver, matching bonding copper wire, and a fixed DTS before sintering Adhesive (optional). The system can extend the service life of power electronic modules by more than 50 times and ensure that the current-carrying capacity of the chip is increased by more than 50%. Die Top System is used in conjunction with copper wire/copper tape to maximize power density and power cycle stability (extend service life).
Condura.prime-has the dual advantages of metal and ceramic
Condura.prime is a cermet substrate made of silicon nitride. Silicon nitride has excellent mechanical properties, including excellent bending strength, high fracture toughness and high thermal conductivity. In addition, silicon nitride has excellent mechanical strength, which ensures the use of a thick copper layer for brazing, which further increases the heat capacity to eliminate load peaks.