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High-purity aluminum sputtering target substrate production line constructed by manufacturer of high-purity aluminum, electronic aluminum foil, and electrode aluminum foil,Achieved commercial production Hay:A01XJZH

High-purity aluminum, electronic aluminum foil, electrode aluminum foil manufacturer XJZH Electronic Materials Technology Group built ultra-high purity aluminum sputtering target substrate production line has achieved commercial production.

XJZH has successfully developed the leading domestic production process and technology of a full set of ultra-high purity aluminum sputtering target substrates, becoming the third complete industrial chain independent of European Hydro Aluminium Company and Sumitomo Chemical System Company of Japan. Through multi-party verification, the product fully meets the market requirements and has successfully achieved mass supply.

High-purity sputtering targets are emerging with the development of the global semiconductor industry. The integrated circuit industry has become one of the main application fields of high-purity sputtering targets. The preparation of semiconductor target substrates is known as the crown of the material preparation industry. On the pearl.

For some time, China has various basic ore sources for aluminum-based sputtering targets, but metal purification technology is mainly controlled by the United States, Japan, Norway, France and other countries. Domestic target material manufacturers mainly obtain high-purity metals and base materials by importing from foreign countries, reaching thousands of tons per year. The prices are high and they cannot be delivered in time.

XJZH, as a research and development enterprise of aluminum electronic new materials in China, is the earliest domestic enterprise that develops and produces high-purity aluminum. It has accumulated more than 30 years of experience in high-purity aluminum R & D and production. The R & D team of the company began the research and development of ultra-high-purity aluminum sputtering target substrates in 2006. Through joint national R & D with integrated circuit related enterprises, it decided to build a pilot test of ultra-high-purity aluminum sputtering target substrates The factory has successively overcome a series of problems such as contamination of impurity elements in the ultra-high purity aluminum (5N5) large-scale production process, product surface quality and internal grain structure refinement control, hydrogen content must be less than 0.1ppm, grain orientation control, etc. The ultra-high purity aluminum sputtering target substrate technology has become the only domestic enterprise that can produce ultra-high purity aluminum sputtering target substrates on a large scale. The aluminum purity can reach 99.9995% (5N5). At the same time, the project "Key Technology and Application of Preparation of Clean, Fine Grain 5N5 Ultra-High Purity Aluminum" jointly declared by XJZH and DB University also won the first prize of the 2019 China Nonferrous Metal Industry Science and Technology Award.

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