The semiconductor chip industry is one of the main application fields of metal sputtering targets, and also the field with the highest requirements on the composition, organization and performance of the target. Specifically, the manufacturing process of semiconductor chips can be divided into three major links: silicon wafer manufacturing, wafer manufacturing, and chip packaging. Among them, metal sputtering targets are required in both wafer manufacturing and chip packaging. .
The function of metal sputtering targets for semiconductor chips is to make metal wires for transmitting information on the chips. Specific sputtering process: First, use high-speed ion current to bombard the surface of different types of metal sputtering targets under high vacuum conditions, so that the atoms on the surface of various targets are deposited layer by layer on the surface of the semiconductor chip Then, through a special processing technology, the metal film deposited on the chip surface is etched into nano-level metal lines, and hundreds of millions of micro-transistors inside the chip are connected to each other to play a role in transmitting signals.
2.1 Smaller process, good for copper and tantalum targets
The main types of metal sputtering targets used in the semiconductor chip industry include: copper, tantalum, aluminum, titanium, cobalt, and tungsten, and high-purity sputtering targets, and nickel, platinum, tungsten, and titanium alloy sputtering targets. Copper targets and tantalum targets are usually used together. At present, the manufacture of wafers is moving towards a smaller process. The application of copper wire technology is gradually increasing. Therefore, the demand for copper and tantalum targets will continue to grow. Aluminum targets and titanium targets are usually used together. At present, in the field of automotive electronic chips and other technology nodes that require more than 110nm to ensure their stability and anti-interference, a large number of aluminum and titanium targets are still required.
2.2 Supply pattern: Chinese target manufacturers achieve a full range of breakthroughs
Supply pattern: Japan's Nippon Metals, Tosoh Corporation, American Honeywell, Praxair, these four target manufacturing international giants, account for about 90% of the global semiconductor chip target market share. At the same time, in recent years, Chinese high-end target manufacturing companies represented by NBJF, BJYY, etc. have also risen rapidly, and have already occupied a place in the global target market.
2.3 Supplier certification: long cycle and strict standards
The certification cycle is long. The certification process of a qualified supplier of target materials by a semiconductor chip manufacturing company is very long and demanding, and generally requires at least 2-3 years. For most of the target production enterprises, it is difficult to bear the huge capital, labor and time costs to be paid during this period, and for chip manufacturing companies, the time cost and risk of developing new qualified suppliers are also high In the case that existing target material suppliers can meet their production needs, there is little interest in introducing new suppliers. These are also one of the reasons for the high-tech barriers in the industry.
Authentication modes vary. Semiconductor chip manufacturers have different certification modes for qualified suppliers of target materials. Among them, to enter the target material suppliers of chip manufacturing companies in Japan, South Korea and other countries, they must be indirectly supplied through intermediaries or trading companies in Japan and South Korea; to enter Intel's target material suppliers, they must pass the application materials (AM ) Recommendation; to enter the target supplier of TSMC, the world's largest foundry company, it needs to be approved by its end customers (Apple, Huawei, etc.).
Supplier's share. Semiconductor chip manufacturers generally choose about three stable suppliers for each sputtering target they need. In addition, the purchase volume from the first-ranked supplier is the largest, the purchase volume from the second-ranked supplier is smaller, and the third-ranked supplier is basically equivalent to the spare tire.
2.4 Market size
Estimated market size of semiconductor targets: Sputtering targets account for about 2.5-3% of semiconductor materials. According to SEMI statistics, the global semiconductor chip sputtering target output value increased from US $ 670 million to 2016-2018 800 million US dollars, CAGR is 9.3%. Due to the direct relationship between the semiconductor sputtering target market and wafer production, the calculation of China's semiconductor fab capacity in China accounts for 15% of the global proportion. China's transfer, it is expected that the domestic semiconductor target market will reach 150 million US dollars in 2019, an increase of 25% year-on-year;
Packaging and testing materials: According to SEMI statistics, in the semiconductor packaging and testing materials market, sputtering targets accounted for about 2.7%. In 2018, the sales of semiconductor packaging and testing materials in China were US $ 19.7 billion. According to a comprehensive calculation, the target market for semiconductors will be about 4.8 billion yuan in 2019.
SEMI estimates that between 2017 and 2020, 62 semiconductor production lines will be added globally, of which 26 new production lines will be in mainland China, accounting for 42%. As the semiconductor industry chain continues to shift to the domestic market, it will promote the further growth of the domestic target market.