Thermal interface material is an indispensable material in consumer electronics, communication equipment, industry and other fields. Its design concept, production process development and application field requirements are closely linked. With the growth of demand in China's downstream communication equipment, consumer electronics, new energy vehicles, and 5G infrastructure construction, the market scale of China's thermal interface materials continues to expand.
In the application of high-power and high-performance graphics cards, in addition to the aging of electronic components, the problem of "oil leakage" in the thermal pads of graphics cards has long existed. The high compressibility of heat dissipation materials and the controllable oil leakage of the materials are difficult to reconcile. contradiction. From an application point of view, the softer the thermally conductive gasket, the better, but if the softness of the gasket is excessively pursued, the price is the inexplicable "lack of elasticity" and "high temperature oil leakage". Generally speaking, the major material manufacturers in the industry still choose to control the hardness at (Shore 00) 20 when producing thermally conductive gaskets.
Honeywell successfully launched an innovative gel-grade thermally conductive gasket (PT series) to perfectly solve the industry pain point of "low hardness while ensuring gasket performance", and has been highly recognized by leading customers in the industry.
Honeywell's gel-grade thermal pad (PT series) has a hardness of only (Shore 00)5, which is truly gel-grade. The low hardness also makes it highly compatible with the electronic components of electronic products that are increasingly light, thin, small, high-density, and multi-functional. At the same time, it can effectively support the heating components when encountering external force disturbances, and always maintain a relatively low interface thermal resistance. I think "toughness" is a more appropriate term to describe this gel-grade thermal pad, soft and strong, not easy to break, stable performance and excellent performance
This is inseparable from Honeywell’s more than half a century of experience in the electronics and semiconductor fields and a strong R&D team-Honeywell’s electronic materials department has nearly 400 approved and pending related patents, providing customers with high The key material for purity and high quality. Secondly, they have always listened to the voice of the market, not satisfying the existing technology accumulation, but hope to achieve self-breakthrough through continuous innovation of technology and products, so as to meet the new needs of the market. The birth of this gel-grade thermal pad is a strong proof that we listen to market demand with innovative technology. This new product comes through the special treatment of powder and the special optimization of the polymer system. The technical basis behind Honeywell's high-quality thermal conductive materials is the surface treatment and production of special metal and ceramic powders on the one hand, and the design of polymers on the other.
Relying on Honeywell's innovative strength, the thermal interface material R&D team has achieved technological breakthroughs in a number of different interface material applications. For example, the phase change material with a thermal conductivity of up to 8.5W/mK developed by the team breaks through the heat dissipation bottleneck of low-thickness thermal interface materials. It has been verified by well-known customers in communications, CPU, GPU and many other industries to verify that it is one of the best heat dissipation solutions.
This year, for the mainstream 5W-7W applications on the market, Honeywell will also launch a new one-component Hybrid (gel) product. Hybrid is between liquid and solid, combining the advantages of thermal grease and thermal pad without the potential problems of the two. Hybrid uses silicone polymer as raw material, mixed with siloxane and high thermal conductivity particles (such as alumina, aluminum nitride powder, etc.). The main difference with thermal grease is that Hybrid does not have oil separation problems during storage. Hybrid can be easily removed and has excellent reworkability. Hybrid only needs relatively low working pressure when connecting with heat sink and chip, and it can be used in a very wide working temperature range.
The new products Hybrid HT5010 and Hybrid HT7000 launched this time can effectively control the problems of vertical flow and cracking without reducing the extrusion rate. This is due to the fact that they grafted the polymer system known for its reliability to the gel product system.