Japan Material Science and Technology Research Co., Ltd. is a company that reutilizes chemical technologies that are not being used and commercializes them. At present, Japan Material Science and Technology Co., Ltd. plans to expand the business related to high-performance materials such as high heat-resistant transparent resins, and has concluded licensing contracts with AGC, Mitsui Chemicals, JNC, JSR and other companies.
At present, 5G can be said to be the focus of chasing in major industries. 5G brings convenience and hope to people, and at the same time brings a series of problems, such as more power consumption and greater heat.
The heat generation problem of 5G is very serious. At the same time, the construction of 5G is also under way. In this case, heat dissipation materials and heat-resistant materials will also usher in a new wave of markets.
Recently, Japan Materials Technology Research Corporation will expand its new horizons in high heat-resistant materials. This material is a transparent resin material with a tricyclodecane (Tricyclodecane) structure. It was discovered by JSR and Tokyo Institute of Technology that at present, the Japanese materials research company has obtained Bis (vinyl sulfone) Tricyclo [5.2.1.02, 6] (VSTCD) and its polymer technology license.
Using this monomer as a polymer raw material, it is expected to develop optical properties such as high refractive index, high Abbe number, low hygroscopicity, high thermal stability, and high glass transition temperature (Tg) New transparent resin with many characteristics.
Japan Materials Science and Technology Corporation plans to apply this material to transparent refractive materials such as Urethane, Acrylic and Polycarbonate (PC), and further achieve the goal of commercialization.
In addition to the above-mentioned high-temperature-resistant transparent resin, Nippon Material Science and Technology also obtained another exclusive authorization from Tokyo Institute of Technology, an oxide ceramic material.
This kind of ceramic material has a thermal expansion rate of minus 187 ppm for every 1 ° C rise in temperature at room temperature. When using this ceramic material with a highly negative linear thermal expansion coefficient as a filler, only a small amount is required Adding it is expected to achieve the function of adjusting thermal expansion. It is currently planned to apply this material to 5G related electronic parts.
In addition to the company, many other companies have also focused on new heat-resistant materials.
For example, on December 19 last year, Japan Toray Industries Co., Ltd. released a polyphenylene sulfide (PPS) film that maintains excellent dielectric properties and chemical stability of PPS polymers.
This kind of film is suitable for polyphenylene sulfide (PPS) film of 5G circuit board. Compared with ordinary PPS film, its heat resistance is also improved by 40 ℃.
In addition to Toray, NOK Japan will promote the industrialization of the newly developed exclusive thermal conduction material "Tran-Q Clay".
"Tran-Q Clay" has a thermal conductivity of 2.8W / (mK), 200 ° C heat resistance and excellent insulation. In addition, the thermal conductivity or hardness can be adjusted through the material design. Since no hardening time or stickiness is required Tired, so it is expected to help improve productivity during assembly.
NOK also plans to achieve mass production in 2020 after obtaining industrial specifications, flame resistance, and long-term reliability assessments.