According to Korean media Business Korea, when the electronic devices placed in the circuit are reduced to the micron level, the distance between the devices becomes narrower when they are arranged on the circuit board, and it is difficult to connect and arrange the electrodes with each other. In order to solve this problem, Professor Kim Tae-il from the Department of Chemical Engineering / Polymer Engineering at Korea ’s Sungkyunkwan University and Samsung Electronics researchers have developed a “conductive adhesive” that can increase the density of integrated circuits by 20 times the above.
This conductive adhesive can be applied to flexible substrates that can be bent and unfolded. This means that this adhesive will pave the way for further miniaturization of biomedical devices, such as wearable devices or micro stimulators that must be flexibly attached to the human body.