Plessey Semiconductor, a leading developer of optoelectronic technology solutions in the UK, said today that it has purchased GEMINI wafer bonding systems from EVG, a wafer bonding and lithography equipment manufacturer.
The company plans to use the system to expand its GaN-on-Si MicroLED manufacturing. Plessey said that GEMINI's wafer bonding systems will be bonded and calibrated at Plessey's manufacturing facility in Plymouth, UK. At the same time, the system can tightly combine its GaN-on-Si MicroLED array with a wafer-level backplane, with the high alignment accuracy required for extremely small pixel sizes.
EVG states that its patented SmartView ® NT automatic bond alignment system technology enables wafer front-side alignment with extremely high accuracy.
In addition, its GEMINI automated wafer bonding system achieves the highest level of automation and process integration. This fully automated platform enables wafer-to-wafer alignment and wafer bonding processes up to 300mm, suitable for mass production.