Londa Electronics will announce the latest miniaturized Micro LED die, which can be as small as 20 microns (μm) or smaller. In addition, Ronda Electronics also released two latest technologies of R / G / B Micro LED die and Color Conversion Micro LED die, providing two different Micro LED die solutions for display applications.
Longda Electronics said that the company is actively investing in the research and development of next-generation LED chip miniaturization and has achieved important results in the field of Micro and Mini LED. And the luminous efficiency can reach more than 30%, showing the company's miniaturization process capability in Mirco LED. In addition, two technologies, R / G / B Micro LED die and Color Conversion Micro LED die, were also released at the same time, which can be applied to the needs of different large-scale transfer processes and display technologies. Manufacturing capabilities of flip chip, Lateral and Vertical Micro LED die. Micro LED is applied to the display. It has the advantages of ultra-fine pixels, high brightness, power saving and high efficiency, long life, fast response time, light weight and short. It is a revolutionary display technology of the next generation. Reality and automotive displays.
Longda Electronics said that the company has been committed to the next generation of LED epitaxy and die miniaturization technology research and development, this time released a series of miniaturized Micro LED die, suitable for mass transfer and color conversion applications, and with a number of Partners work closely together.
This latest series of Micro LED die technology will be unveiled for the first time at Touch Taiwan 2018 exhibition held in Taipei Nangang Exhibition Hall from August 29 to 31.