China's high-precision electronic copper foil and copper clad laminate manufacturer GDCH Electronic Materials Technology Group currently has copper foil production capacity of 12,000 tons / year, copper clad laminate production capacity of 12 million sheets / year, and PCB production capacity of 7.4 million square meters / year.
On September 17, GDCH's new high-precision electronic copper foil project (second phase) project with an annual output of 8,000 tons was officially launched. By then, the company's total copper foil production capacity will exceed 20,000 tons. At the same time, the company launched a non-public offering in 2019. The fundraising projects are an annual output of 1.2 million square meters of printed circuit board (including FPC) construction projects and an annual output of 6 million high-end core board projects. In addition, the company plans to build an electronic information industry base in Meizhou. The first phase of the project plans to build a high-precision electronic copper foil project with an annual output of 20,000 tons; the second phase plans to build a high-frequency high-speed copper clad laminate project with an annual output of 20 million. Ongoing.
In 2018, the global electronic copper foil market demand was 683,000 tons, and the domestic electronic copper foil market demand reached 474,300 tons, of which the demand for lithium electrical copper foil increased significantly by 55.8%, benefiting from the rapid downstream industries such as 5G, new energy vehicles, and automotive electronics. Development, the demand for copper foil is constantly increasing, which drives the company's copper foil product gross profit to increase. At the same time, in recent years, GDCH has continuously optimized its product structure and increased R & D investment in electronic substrate industries such as copper foil and copper clad laminates. The competitiveness of the product has been continuously improved, and the gross profit margin has increased accordingly. In addition, the copper price this year is lower than in previous years, and the copper foil processing fee is relatively fixed. The company also improved the gross profit margin of the company's products through scientific management and control of procurement and production.
As one of the companies covering the entire industrial chain of copper foil, copper clad laminates and printed circuit boards, the company's products are indispensable raw materials for 5G, new energy vehicles, consumer electronics, and automotive electronics. Benefiting from the rapid development of 5G, new energy vehicles, automotive electronics and other industries, the company's industry has also ushered in good development opportunities.
In recent years, large domestic companies such as Huawei have been increasing their efforts to build a domestically-made industrial supply chain. This will accelerate the leapfrog development of China's PCB substrate materials, accelerate the domesticization process of high-end products, break foreign monopolies, and improve domestic PCBs. And electronics substrate manufacturing level and enhance overall competitiveness.
In order to grasp the development opportunities of 5G, new energy vehicles and other industries, GDCH and Shanghai Jiaotong University jointly established a joint research center for electronic materials to study key technologies such as high-frequency and high-speed (5-10G) copper foil and substrate materials. At present, the company Trial production of high frequency and high speed copper foil will become one of the few domestic companies with production technology in this field. At the same time, the industrialization of the "nanometer paper-based high-frequency high-speed substrate technology" developed by the company in conjunction with South China University of Technology and Harbin University of Science and Technology has achieved staged results, and related technologies have reached domestic leading levels. In terms of PCB, the company is also producing multilayer circuit boards with a target of more than 20 layers to meet the needs of higher-end communication technologies.